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KYOCERA KE-G1270

Generic Family: Epoxy; EpoxideSupplied by: KYOCERA Chemical Corporation
Special Epoxy Molding Compounds Optimizing Warpage and Applicable to Fine Pitch Wire for BGA Package

Strong Points
  • Less Warpage in All Types of Area Array Packages due to High Tg Characteristic.
  • Applicable to Fine Pitch Wire Bonding with Good Wire Sweep Performance.
  • Achieve High Yield after Molding due to Excellent Moldability that allows its application to MAP.

Application
  • Standard P-BGA, HS-BGA and LGA Package.
  • Multi Chip Module (Stacked or Side by Side Layout)
  • IC Card, Memory Card etc.

Low Alpha Ray Type: KE-G2270
General Properties

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Material Status
Commercial: Active
Documents
description

Technical Datasheet (English)

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Availability
Asia Pacific
Uses
Electrical/Electronic Applications
Other Properties
Features, Density / Specific Gravity, Spiral Flow, Solution Viscosity, Flexural Modulus, Flexural Strength, Glass Transition Temperature, CLTE, Flow
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Processing

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Where To Buy

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