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KYOCERA KE-300AH

Generic Family: 环氧; 环氧树脂Supplied by: KYOCERA Chemical Corporation
High Reliable and Easy-to-Use Molding Compounds for Various Type of Packages

Strong Points
  • Provide Various Molding Compounds with High Reliability to Cover Many Applications such as LSI, Transistors and Diodes.
  • Good Curability and Applicable to Various Molding Machines (Both Automated and Conventional)
  • Low Stress of Large chips and Applicable to Encapsulation.

Application
Smaller SOP, Smaller QFP, DIP, SIP/ZIP, TO-PKG, DPAK, SOT, Unbalanced PKG, Module
General Properties

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Material Status
已商用:当前有效
Documents
description

Technical Datasheet (English)

Download Document
Availability
亚太地区
Uses
电气/电子应用领域
Other Properties
密度 / 比重, Spiral Flow, 弯曲模量, 弯曲强度, 玻璃转化温度, CLTE,流动, Gel Time
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Processing

Find specific processing information for KYOCERA as well as general information for the 环氧; 环氧树脂 generic family. Register or Sign In for more information.

Where To Buy

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