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KYOCERA KE-G200V

Generic Family: Epoxy; EpoxideSupplied by: KYOCERA Chemical Corporation
High Reliable and Easy-to-Use Molding Compounds for Various Type of Packages

Strong Points
  • Provide Various Molding Compounds with High Reliability to Cover Many Applications such as LSI, Transistors and Diodes.
  • Good Curability and Applicable to Various Molding Machines (Both Automated and Conventional)
  • Low Stress of Large chips and Applicable to Encapsulation.

Application
Smaller SOP, Smaller QFP, DIP, SIP/ZIP, TO-PKG, DPAK, SOT, Unbalanced PKG, Module
General Properties

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Material Status
Commercial: Active
Documents
description

Technical Datasheet (English)

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Availability
Asia Pacific
Uses
Electrical/Electronic Applications
Other Properties
Density / Specific Gravity, Spiral Flow, Flexural Modulus, Flexural Strength, Glass Transition Temperature, CLTE, Flow, Gel Time
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Processing

Find specific processing information for KYOCERA as well as general information for the Epoxy; Epoxide generic family. Register or Sign In for more information.

Where To Buy

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