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KYOCERA KE-850SH

Generic Family: 环氧; 环氧树脂Supplied by: KYOCERA Chemical Corporation
Developed for Power Device Package that needs Good Heat Dissipation Through Molding Compound.

Strong Points
  • High Thermal Conductivity with Good Moldability, Excellent Moisture Resistance and Low Stress.
  • Used in Auto Molding System by Rapid Cure Grades.
  • KE-870 and KE-880 is Formulated with Special High Thermal Conductivity Filler System and Achieve High Thermal Conductivity (above 3W/m K).

Application
  • Isolation Packages such as TO-220 and TO-3P that need Heat Dissipation Characteristics.
  • Packages for High Heating Volume such as Power Module.
General Properties

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Material Status
已商用:当前有效
Documents
description

Technical Datasheet (English)

Download Document
Availability
亚太地区
Uses
电气/电子应用领域
Other Properties
特性, 密度 / 比重, Spiral Flow, 玻璃转化温度, CLTE,流动, 导热系数, Gel Time
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Processing

Find specific processing information for KYOCERA as well as general information for the 环氧; 环氧树脂 generic family. Register or Sign In for more information.

Where To Buy

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