KYOCERA KE-880
Strong Points
- High Thermal Conductivity with Good Moldability, Excellent Moisture Resistance and Low Stress.
- Used in Auto Molding System by Rapid Cure Grades.
- KE-870 and KE-880 is Formulated with Special High Thermal Conductivity Filler System and Achieve High Thermal Conductivity (above 3W/m K).
Application
- Isolation Packages such as TO-220 and TO-3P that need Heat Dissipation Characteristics.
- Packages for High Heating Volume such as Power Module.
General Properties
Access the complete datasheet details for KYOCERA KE-880 when you create your free account with Prospector. You’ll find complete information on physical, mechanical and hardness specs.
E43857 - KYOCERA Corporation
Download DocumentProcessing
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Where To Buy
You can purchase KYOCERA KE-880 from 1 distributors or manufacturers. Register or Sign In for more information.
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