40-3900 is a two component epoxy adhesive filled with silver. This electrically conductive epoxy resin formulation offers continuity of conductivity with an electrical resistivity value of less than 1x10^-4 ohm-cm. 40-3900 is also well known for its wide operating temperature range, -50 to + 170°C.

40-3900 is specifically designed for adhesive bonding in microelectronic and optoelectronic applications. Due to its excellent continuity, it has also been used extensively in applications such as micro-wave EMI and RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connectors, circuitry, and as a cold solder.

40-3900 is formulated with pure silver (no alloys) and is designed in a convenient 1:1 mix ratio. Both the resin and hardener have silver powder dispersed.

Features:
- Electrically conductive
- Thermally conductive
- Room temperature cure
- Easy 1:1 mix ratio
- Good bond strength