Epoxies, Ect. 20-1640
20-1640 can be used for potting or encapsulating electronic packages that have sensitive components. Due to its low stress during and after cure, this material will not crush or damage delicate components.
20-1640 is formulated without solvents or other toxic materials. It is therefore not regulated or considered hazardous for transportation.
Features:
- Flexible
- Deep section curing (beyond 1-2 inches)
- High operating temperature
- Solvent free
Benefits:
- Low stress on components and vibration resistant
- No need for multiple pours due to low exotherm
- Good protection in extreme environmental applications
- No by-products released during cure and safe to handle
General Properties
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Technical Datasheet (English)
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Where To Buy
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