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Plaskon 3400-2

Generic Family: Epoxy; Epoxide • Supplied by: Cookson Electronics - Semiconductor Products
This material is a reduced-stress epoxy molding compound for the enapsulation of a variety of semiconductor devices ranging from small lead count DIPs to medium lead count PLCCs, QFPs and SOICs. It was especially developed for balanced end use properties.
General Properties

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Material Status
Commercial: Active
Availability
North America
Processing Method
Resin Transfer Molding
Other Properties
Features, Forms, Density / Specific Gravity, Flexural Modulus, Flexural Strength, Glass Transition Temperature, CLTE, Flow, Thermal Conductivity, Volume Resistivity, Dielectric Strength, Dielectric Constant, Dissipation Factor, Arc Resistance, Flame Rating, Oxygen Index, Additional Information, Injection Notes
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Processing

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Where To Buy

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