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Plaskon 3400F-14

Generic Family: Epoxy; Epoxide • Supplied by: Cookson Electronics - Semiconductor Products
This material is a fast curing, reduced-stress epoxy molding compound for the encapsulation of semiconductor devices including DIPs, PLCCs, SOICs and medium lead count QFPs. It was developed with fine filler particles especially for use with automated or conventional molding equipment and offers a balance of end use properties.
General Properties

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Material Status
Commercial: Active
Availability
North America
Processing Method
Resin Transfer Molding
Other Properties
Features, Forms, Density / Specific Gravity, Flexural Modulus, Flexural Strength, Glass Transition Temperature, CLTE, Flow, Thermal Conductivity, Volume Resistivity, Dielectric Strength, Dielectric Constant, Dissipation Factor, Arc Resistance, Flame Rating, Oxygen Index, Additional Information, Injection Notes
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Processing

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Where To Buy

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