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Plaskon S-7PG

Generic Family: Epoxy; Epoxide • Supplied by: Cookson Electronics - Semiconductor Products
This material is a low stress, low viscosity epoxy encapsulant designed for packaging stress-sensitive semiconductor devices. It is specifically formulated to provide a lower viscosity for those low stress applications where wire sweep may be a concern. It offers end users superior value-in-use due to a balanced mix of properties.
General Properties

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Material Status
Commercial: Active
Availability
North America
Processing Method
Resin Transfer Molding
Other Properties
Features, Forms, Density / Specific Gravity, Mold Shrink, Linear-Flow, Tensile Strength, Flexural Modulus, Flexural Strength, Glass Transition Temperature, CLTE, Flow, Thermal Conductivity, Volume Resistivity, Dielectric Strength, Dielectric Constant, Dissipation Factor, Arc Resistance, Flame Rating, Oxygen Index, Additional Information, Injection Notes
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Processing

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Where To Buy

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