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ULTEM™ Resin HU1010

Generic Family: Polyetherimide • Supplied by: SABIC
ULTEM HU1010 resin is an unreinforced amorphous polyetherimide (PEI) resin that may offer a high glass transition temperature (Tg) of 217°C and improved flow. The intended use for this material is in medical devices and pharmaceutical applications. The materials is biocompatible (ISO 10993 or USP Class VI) and Healthcare management of change applies . The material may offer Steam-, Peroxide-, Gamma-, EtO-, UV-C- and E-beam resistance for repeated sterilization cycles. It may offer global food compliance (FDA, CN, EC). Features are excellent mechanical, electrical and dimensional properties up to high temperatures. The material may offer very good chemical resistance for an amorphous material and is inherently flame retardant offering UL94 V0 and 5V ratings. The material is RoHS compliant. The base material is transparent amber colored but is also available in custom colors - transparent and opaque.

ISCC+ certified renewable bio-based solutions are available for this grade via differentiated color nomenclature.
General Properties

Access the complete datasheet details for ULTEM™ Resin HU1010 when you create your free account with Prospector. You’ll find complete information on physical, mechanical and hardness specs.

Material Status
Commercial: Active
Documents
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E121562 - SABIC INNOVATIVE PLASTICS US L L C

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Brochure - BIO-CIRCULAR ULTEM™ RESINS ISCC+ CERTIFIED SUSTAINABILITY (English)

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Brochure - INNOVATIVE ULTEM™ RESINS FOR ADVANCED CONNECTORS (English)

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Availability
Africa & Middle East, Asia Pacific, Europe, Latin America, North America
Uses
Additive Manufacturing (3D Printing)
Processing Method
3D Printing, Fused Deposition Modeling (FDM)
Multi-Point Data
  • Coefficient of Thermal Expansion vs. Temperature (ISO 11403)
  • Compressive Stress vs. Strain (ASTM D6641)
  • Flexural DMA (ASTM D5023)
  • Isothermal Stress vs. Strain (ISO 11403)
  • Shear DMA (ASTM D4065)
  • Shear Stress vs. Shear Strain (ASTM D5379)
  • Specific Heat vs. Temperature (ASTM E1269)
  • Specific Volume vs Temperature (ISO 11403)
Other Properties
Features, Agency Ratings, Appearance, Density / Specific Gravity, Density, Melt Mass-Flow Rate (MFR), Melt Volume-Flow Rate (MVR), Molding Shrinkage, Water Absorption @ 24 hrs, Water Absorption 24h/23C, Water Absorption @ Sat., Water Absorption Sat/23C, Water Absorption 23C/50RH, Tensile Modulus, Tensile Modulus, Tensile Strength at Yield, Tensile Stress at Yield, Tensile Elongation at Yield, Tensile Strain at Yield, Tensile Elongation at Break, Tensile Strain at Break, Flexural Modulus, Flexural Modulus, Flexural Stress, Flexural Strength at Yield, Poisson's Ratio, Taber Abrasion Resistance, Charpy Notched Impact Strength, Notched Izod Impact, Notched Izod Impact Strength, Unnotched Izod Impact, Unnotched Izod Impact Strength, Reverse Notch Izod Impact, Gardner Impact, Rockwell Hardness, Rockwell Hardness, Ball Indentation Hardness, DTUL (66 psi) - Unannealed, DTUL (0.45 MPa) Unannealed, DTUL (264 psi) - Unannealed, DTUL (1.80 MPa) Unannealed, Vicat Softening Temperature, Vicat Softening Temperature, Ball Pressure Test, CLTE, Flow (TMA), Coefficient of Linear Thermal Expansion, Flow, CLTE, Transverse (TMA), Coefficient of Linear Thermal Expansion, Transverse, Thermal Conductivity, Thermal Conductivity, RTI Elec, RTI Imp, RTI Str, Surface Resistivity, Volume Resistivity, Volume Resistivity, Dielectric Strength, Electric Strength, Dielectric Constant, Relative Permittivity, Dissipation Factor, Dissipation Factor, Arc Resistance, Comparative Tracking Index (CTI), Comparative Tracking Index, High Amp Arc Ignition (HAI), High Voltage Arc Resistance to Ignition (HVAR), Hot-wire Ignition (HWI), Flame Rating, Oxygen Index, Oxygen Index, Additional Properties, Drying Temperature, Drying Time, Suggested Max Moisture, Suggested Shot Size, Rear Temperature, Middle Temperature, Front Temperature, Nozzle Temperature, Processing (Melt) Temp, Mold Temperature, Back Pressure, Vent Depth, Injection Notes, Extrusion Notes
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Processing

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Where To Buy

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