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Hysol® FP6401

Generic Family: Epoxy; EpoxideSupplied by: Henkel AG & Co. KGaA
FP6401 damming material is designed as a flow control barrier around areas of bare chip encapsulation. Its extremely low modulus makes it ideal for the protection of devices that are stress sensitive or that have tight coplanarity requirements. It should be co-cured with the encapsulant material. FP6401 exhibits high adhesion to flexible and rigid circuit substrates.

Product Benefits
  • High purity
  • Liquid flexible
  • Low viscosity
  • High thixotropy
  • Minimal slumping
  • Low modulus
General Properties

Access the complete datasheet details for Hysol® FP6401 when you create your free account with Prospector. You’ll find complete information on physical, mechanical and hardness specs.

Material Status
Comercial: Ativo
Documents
description

Technical Datasheet (English)

Download Document
Availability
África & Oriente Médio, América do Norte, América Latina, Ásia/Pacífico, Europa
Uses
Aplicações Elétricas/Eletrônicas
Processing Method
Encapsulamento
Other Properties
Carga/Reforço, Características, Aparência, Módulo de Tensão, Tensão, Alongamento na Ruptura, Temperatura de transição vítrea, Coeficiente de expansão térmica linear, Fluxo, Densidade, Viscosidade, Curing Time, Pot Life, Shelf Life
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Processing

Find specific processing information for Hysol® as well as general information for the Epoxy; Epoxide generic family. Register or Sign In for more information.

Where To Buy

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