STYCAST® A 312
STYCAST A 312 is a one component, unfilled, solventless epoxy underfill encapsulant. STYCAST A 312 is a fast curing product with excellent chemical, heat and moisture resistance combined with good dielectric properties.
Application
STYCAST A 312 can be used as capillary flow underfill on CSP & BGA devices. STYCAST A 312 improves the attachment strength of CSP & BGA devices during mechanical stress testing such as drop and bend testing.
General Properties
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Technical Datasheet (English)
Download DocumentProcessing
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Where To Buy
You can purchase STYCAST® A 312 from 1 distributors or manufacturers. Register or Sign In for more information.
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