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STYCAST® 50500-1

Generic Family: Epoxy; EpoxideSupplied by: Henkel AG & Co. KGaA
STYCAST 50500-1 fill encapsulant is designed to be used with STYCAST 50300 HT dam encapsulant in glob top applications. This combination of materials is also suited for the protection of multiple chips and for encapsulating components where a well defined glob height and flat surface are required.
General Properties

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Material Status
Comercial: Activo
Documents
description

Technical Datasheet (English)

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Availability
África y Oriente Medio, Asia-Pacífico, Europa, Latinoamérica, Norteamérica
Uses
Aplicaciones eléctricas/electrónicas
Processing Method
Encapsulado
Other Properties
Carga/refuerzo, Características, Aspecto, Dureza Shore, Temperatura de transición vítrea, Coeficiente de dilatación térmica lineal (CLTE), flujo (TMA), Conductividad térmica, Constante dieléctrica, Factor de disipación, Propiedades adicionales, Contenido de Sólidos, Densidad, Viscosidad, Tiempo de curado, Vida útil en depósito
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Processing

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Where To Buy

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