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Hysol® CB0260-1

Generic Family: Epoxy; EpoxideSupplied by: Henkel AG & Co. KGaA
CB0260-1 features excellent flow properties allowing it to penetrate fine pitch wires and deep cavities without entrapping voids. This product can withstand solder reflow after being exposed to JEDEC level 2 (85°C/60% RH, 168 hours) preconditioning. A cavity or potting dam is required for flow control.
General Properties

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Material Status
供給可能
Documents
description

Technical Datasheet (English)

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Availability
アジア太平洋地域, アフリカ&中東, ラテンアメリカ, 北アメリカ, 欧州
Uses
Encapsulant
Processing Method
封入
Other Properties
フィラー/強化剤, 特徴, 外観, 曲げ弾性率, 曲げ強度, ショア硬度, ガラス転移温度, 線膨張係数、平行, 体積抵抗率, 誘電率, 誘電正接, その他の特性, 密度, 動粘性率, 硬化時間, Gel Time, ポットライフ, 有効期限
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Processing

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Where To Buy

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