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Hysol® EO7039

Generic Family: Epoxy; EpoxideSupplied by: Henkel AG & Co. KGaA
EO7039 encapsulant is designed for attachment of integrated circuits and components to advanced flexible substrates. This material is formulated to produce a void-free bond line with excellent interfacial adhesive strength to a wide variety of organic substrates and various metal surfaces.
General Properties

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Material Status
Comercial: Activo
Documents
description

Technical Datasheet (English)

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Availability
África y Oriente Medio, Asia-Pacífico, Europa, Latinoamérica, Norteamérica
Uses
Aplicaciones eléctricas/electrónicas
Processing Method
Encapsulado
Other Properties
Características, Aspecto, Temperatura de transición vítrea, Coeficiente de expansión térmica lineal, flujo, Propiedades adicionales, Viscosidad, Tiempo de curado, Vida útil, Vida útil en depósito
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Processing

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Where To Buy

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