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Hysol® EO7039

Generic Family: Epoxy; EpoxideSupplied by: Henkel AG & Co. KGaA
EO7039 encapsulant is designed for attachment of integrated circuits and components to advanced flexible substrates. This material is formulated to produce a void-free bond line with excellent interfacial adhesive strength to a wide variety of organic substrates and various metal surfaces.
General Properties

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Material Status
Comercial: Ativo
Documents
description

Technical Datasheet (English)

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Availability
África & Oriente Médio, América do Norte, América Latina, Ásia/Pacífico, Europa
Uses
Aplicações Elétricas/Eletrônicas
Processing Method
Encapsulamento
Other Properties
Características, Aparência, Temperatura de transição vítrea, Coeficiente de expansão térmica linear, Fluxo, Propriedades adicionais, Viscosidade, Curing Time, Pot Life, Shelf Life
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Processing

Find specific processing information for Hysol® as well as general information for the Epoxy; Epoxide generic family. Register or Sign In for more information.

Where To Buy

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