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MODIC™ P553E

Generic Family: 聚丙烯无规共聚物Supplied by: Mitsubishi Chemical Performance Polymers, Inc.
Base Resin: Random-PP
Type: High Performance Tie-Resin
Co-extruded resin: PP / EVOH, PP/ Polyamide
Application: Blown film, Cast film, Sheet
General Properties

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Material Status
已商用:当前有效
Documents
description

Technical Datasheet (English)

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Availability
亚太地区, 北美洲, 欧洲
Uses
Blown Film
Processing Method
吹塑薄膜
Other Properties
密度, 熔流率(熔体流动速率), 拉伸断裂应力, 拉伸断裂应变, 肖氏硬度, 维卡软化温度, 溶融温度(DSC)
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Processing

Find specific processing information for MODIC™ Tie Resin as well as general information for the 聚丙烯无规共聚物 generic family. Register or Sign In for more information.

Where To Buy

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