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Platamid® B 409

Generic Family: Polyamide CopolymerSupplied by: Arkema High Performance Polymers
Copolyamide Hot Melt Adhesive / Extrusion Applications

Platamid® B 409 is a high molecular weight, high melting temperature range, partially crystalline copolyamide delivered in pellet form. The special interest of this product is the combination of high melting temperature and high melt viscosity.
Platamid® B 409 can be applied out of a cresolic solution. The thermal activation of the hot melt layer can be accomplished by means of induction of hot air.
General Properties

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Material Status
Commercial: Active
Documents
description

Technical Datasheet (English)

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Availability
Africa & Middle East, Asia Pacific, Europe, Latin America, North America
Uses
Adhesives
Processing Method
Extrusion
Other Properties
Features, Forms, Density, Melt Volume-Flow Rate (MVR), Melting Temperature
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Processing

Find specific processing information for Platamid® as well as general information for the Polyamide Copolymer generic family. Register or Sign In for more information.

Where To Buy

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