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AvaSpire® AV-622

Generic Family: Polyaryletherketone • Supplied by: Syensqo
AvaSpire® AV-622 is an unreinforced polyaryletherketone (PAEK) that offers improved ductility and impact strength relative to PEEK while retaining most of the key performance attributes of PEEK. The AV-622 grade is the low melt flow (higher molecular weight) resin that is suited for a variety of processing methods including compression molding, stock shape extrusion, as well as injection molding.

AV-622 has been formulated for applications requiring a balance of chemical resistance and mechanical strength along with good part aesthetics and high purity, thereby bridging the performance gaps within the ultra polymers space. These and other properties make this resin well-suited for applications in semiconductor, electronics, and other industries.

AvaSpire® AV-622 is easily fabricated using conventional thermoplastic melt processing techniques and standard equipment. The resin has a uniform opaque appearance with a beige color similar to that of PEEK.
  • AvaSpire® AV-622 NT
General Properties

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Material Status
Commercial: Active
Documents
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Technical Datasheet

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Availability
Africa & Middle East, Asia Pacific, Europe, Latin America, North America
Uses
Semiconductor Applications
Processing Method
Extrusion Blow Molding
Other Properties
Features, RoHS Compliance, Appearance, Forms, Density / Specific Gravity, Melt Mass-Flow Rate (MFR), Mold Shrink, Linear-Flow, Mold Shrink, Linear-Trans, Water Absorption @ 24 hrs, Tensile Modulus, Tensile Modulus, Tensile Strength, Tensile Stress at Yield, Tensile Elongation at Yield, Tensile Strain at Yield, Tensile Elongation at Break, Tensile Strain at Break, Flexural Modulus, Flexural Modulus, Flexural Strength, Flexural Stress, Compressive Strength, Shear Strength, Poisson's Ratio, Notched Izod Impact, Notched Izod Impact Strength, Unnotched Izod Impact, Unnotched Izod Impact Strength, Rockwell Hardness, DTUL (264 psi) - Annealed, Glass Transition Temperature, Peak Melting Temperature, CLTE, Flow (TMA), Specific Heat, Thermal Conductivity, Surface Resistivity, Volume Resistivity, Dielectric Strength, Dielectric Constant, Dissipation Factor, Flame Rating, Oxygen Index, Melt Viscosity, Drying Temperature, Drying Time, Rear Temperature, Middle Temperature, Front Temperature, Nozzle Temperature, Processing (Melt) Temp, Mold Temperature, Injection Rate, Screw Compression Ratio
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Processing

Find specific processing information for AvaSpire® PAEK as well as general information for the Polyaryletherketone generic family. Register or Sign In for more information.

Where To Buy

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