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Miramid® FB30C

Generic Family: 聚酰胺 6Supplied by: BASF Leuna GmbH
General Properties

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Material Status
已商用:当前有效
Documents
description

Processing - Injection Molding (English)

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description

Technical Datasheet (English)

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Availability
欧洲
Uses
外壳
Processing Method
注射成型
Multi-Point Data
  • Isothermal Stress vs. Strain (ISO 11403)
  • Secant Modulus vs. Strain (ISO 11403)
Other Properties
填料/增强材料, 添加剂, 特性, 形式, 密度, 吸水率, 吸湿性, 粘数, 拉伸模量, 断裂应力, 断裂应变, 简支梁缺口冲击强度 (+23°C), 简支梁缺口冲击强度 (-30°C), 简支梁冲击强度 (+23°C), 简支梁冲击强度 (-30°C), 载荷下挠曲温度 (0.45 MPa), 载荷下挠曲温度 (1.80 MPa), 溶融温度(DSC), 体积电阻率, 介电常数, 损耗因子 (1 MHz), 漏电起痕指数
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Processing

Find specific processing information for Miramid® Polyamide as well as general information for the 聚酰胺 6 generic family. Register or Sign In for more information.

Where To Buy

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