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Miramid® H3CW

Generic Family: Polyamide 6Supplied by: BASF Leuna GmbH
General Properties

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Material Status
供給可能
Documents
description

Processing - Injection Molding (English)

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description

Technical Datasheet (English)

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Availability
欧州
Uses
エンジニアリングパーツ
Automative Specification
FMVSS 302
Processing Method
射出成形
Other Properties
添加剤, 特徴, 形状, 密度, 水分吸収, 吸湿性, 粘度数, 引張り係数, 降伏応力, 降伏歪み, 引張り破壊呼び歪み, ノッチ付シャルピー衝撃強度(+23℃), ノッチ付シャルピー衝撃強度(-30℃), シャルピー衝撃強度(+23℃), シャルピー衝撃強度(-30℃), 荷重たわみ温度(0.45MPa), 荷重たわみ温度(1.80MPa), 溶融温度(DSC), 容積抵抗性, 誘電率, 散逸率(1 MHz), 比較トラッキング指数, 成形(溶融)温度, 金型温度
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Processing

Find specific processing information for Miramid® Polyamide as well as general information for the Polyamide 6 generic family. Register or Sign In for more information.

Where To Buy

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