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Plaskon AMC-2RC

Generic Family: Epoxy; Epoxide • Supplied by: Cookson Electronics - Semiconductor Products
This material is an epoxy molding compound specifically formulated for encapsulation of stress sensitive electronic devices including DIPs, SOICs, SSOPs and PLCCs. It can be used in conventional or automold applications.
General Properties

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Material Status
Commercial: Active
Availability
North America
Uses
Automotive Applications
Processing Method
Resin Transfer Molding
Other Properties
Features, Forms, Density / Specific Gravity, Flexural Modulus, Flexural Strength, Glass Transition Temperature, CLTE, Flow, Volume Resistivity, Dielectric Strength, Dielectric Constant, Dissipation Factor, Arc Resistance, Flame Rating, Oxygen Index, Additional Information, Injection Notes
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Processing

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Where To Buy

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