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Plaskon LS-16

Generic Family: Epoxy; Epoxide • Supplied by: Cookson Electronics - Semiconductor Products
This material is a low stress molding compound specifically formulated for use with automated molding equipment to increase semiconductor manufacturing productivity and reduce production costs. This compound is recommended for molding of stress sensitive DIPs, SOICs, PLCCs and small QFPs.
General Properties

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Material Status
Commercial: Active
Availability
North America
Processing Method
Resin Transfer Molding
Other Properties
Features, Forms, Density / Specific Gravity, Flexural Modulus, Flexural Strength, Glass Transition Temperature, CLTE, Flow, Volume Resistivity, Dielectric Strength, Dielectric Constant, Dissipation Factor, Arc Resistance, Flame Rating, Oxygen Index, Additional Information, Injection Notes
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Processing

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Where To Buy

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