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Plaskon ALP-2 (197)

Generic Family: Epoxy; Epoxide • Supplied by: Cookson Electronics - Semiconductor Products
This material is an epoxy encapsulant for high productivity packaging of very thin, stress-sensitive devices such as TSSOP's. Performance attributes are intended to meet or exceed JEDEC Level 1 for all packages and have no or limited post-mold cure, fast cure cycle times tailored to specific applications and excellent adhesion to Cu and Pd-Ni leadframes.
General Properties

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Material Status
Commercial: Active
Availability
North America
Uses
Thin-walled Packaging
Processing Method
Resin Transfer Molding
Other Properties
Features, Forms, Density / Specific Gravity, Flexural Modulus, Flexural Strength, Glass Transition Temperature, CLTE, Flow, Thermal Conductivity, Volume Resistivity, Dielectric Strength, Dielectric Constant, Flame Rating, Additional Information, Injection Notes
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Processing

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Where To Buy

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