Prospector

Plaskon CMU-880-MA

Generic Family: Epoxy; Epoxide • Supplied by: Cookson Electronics - Semiconductor Products
This material is an epoxy Molded Underfill compound developed for transfer mold equipment to underfill, and overmold if needed, Flip Chip in Package (FC-BGA and FC-CSP) in one step. It offers high productivity with an automated, simple, robust and fast process compared to liquid encapsulation. Higher reliability is demonstrated with the material's higher Tg, lower CTE, no particle segregation or settling and longer outlife compared to liquid encapsulants. PLASKON? CMU Series is the total molded underfill solution for Flip Chip in Package.
General Properties

Access the complete datasheet details for Plaskon CMU-880-MA when you create your free account with Prospector. You’ll find complete information on physical, mechanical and hardness specs.

Material Status
Commercial: Active
Availability
North America
Processing Method
Resin Transfer Molding
Other Properties
Features, Forms, Density / Specific Gravity, Flexural Modulus, Flexural Strength, Glass Transition Temperature, CLTE, Flow, Thermal Conductivity, Flame Rating, Additional Information, Injection Notes
Access 11 properties in Plastics. Create your free account or sign into Prospector.
Processing

Find specific processing information for Plaskon as well as general information for the Epoxy; Epoxide generic family. Register or Sign In for more information.

Where To Buy

You can purchase Plaskon CMU-880-MA from 1 distributors or manufacturers. Register or Sign In for more information.

Prospector Sign in / Register
Premium Features
Find UL Yellow Cards
UL Yellow Cards

UL's Yellow Cards are a globally recognized safety and quality guarantee, a certified demonstration of how plastics have met a specific set of performance credentials.

Find UL Yellow Cards

PROSPECTOR

Find solutions, not just materials.

When you join Prospector, you leverage the dynamic tools and features to find solutions fast.

Register Today