ABLEBOND® 789-3™ die attach adhesive is designed for microelectronic applications. This adhesive exhibits strong adhesion to difficult-to-bond metals and retains its bond strength after exposure to moisture.

ABLEBOND® 84-1LMI die attach adhesive is designed for microelectronic chip bonding. This adhesive is ideal for application by automatic dispenser or hand probe. ABLEBOND® 84-1LMI meets the requirements of MIL-STD-883, Method 5011.

ABLEBOND® 84-1LMINB1 die attach adhesive is formulated to bond difficult-to-wet surfaces such as palladium-silver capacitors terminations. This adhesive reduces capacitor shorting problems caused by resin bleed. ABLEBOND® 84-1LMINB1 meets the requirements of MIL-STD-883, Method 5011.

ABLEBOND® 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput, automatic die attach equipment. The rheology of ABLEBOND 84-1LMISR4 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems. The unique combination of adhesive properties makes this material one the most widely used die attach materials in the semiconductor industry.

ABLEBOND® 84-1LMIT1 adhesive is designed for die attach applications. It is designed for screen printing using 325 mesh. ABLEBOND® 84-1LMIT1 meets the requirements of MIL-STD-883C, Method 5011.

ABLEBOND® 84-3 adhesive is designed for die attach applications. This adhesive is ideal for application by automatic dispensing, screen printing or hand.

ABLEBOND® 85-1® adhesive is designed for hybrid applications where silver migration is a critical concern. ABLEBOND® 85-1® meets the requirements of MIL-STD-883, Method 5011.

ABLEBOND® 958-11 adhesive is designed to absorb stresses produced when bonding large ICs. ABLEBOND® 958-11 meets the requirements of MIL-STD-883, Method 5011.

ABLEBOND® 965-1L electrically conductive, stress-absorbing die attach adhesive is designed for bonding large die integrated circuits to substrates with mismatched coefficients of thermal expansion. ABLEBOND 965-1L adhesive exhibits very low levels of contaminants. The rheology of this adhesive is tailored for high speed,automated assembly operations. This product cures to yield a void-free bondline with minimal resin bleed.

ABLEBOND® 967-1™ adhesive is designed for applications which require lower-than-normal cure temperatures. It is ideal for application by automatic dispenser, screen printing, or hand probe.

ABLEBOND® 967-3™ adhesive is designed for applications which require lower-than-normal cure temperatures. It is ideal for application by automatic dispenser, screen printing, or hand probe. This material is a electrically insulating version of ABLEBOND 967-1 adhesive.

ABLEFILM® 550™ adhesive film is designed for substrate attach and sealing microelectronic packages. This adhesive film gives off methanol, water, and ammonia during cure. Note: Using ABLEFILM® 550™ adhesive in hermetically sealed packages is not recommended.

ABLEFILM® 550K™ is designed for substrate attach and heat sink bonding.

ABLEFILM® 561 glass supported, modified epoxy adhesive film is designed for bonding materials with severely mismatched coefficients of thermal expansion. In many bonding applications, components bonded with ABLEFILM 561 adhesive film can be repaired. After heating the component to 150°C, de-bonding can be accomplished by sliding a thin blade, such as a razor blade, between the bonded surfaces. This adhesive film is also available in a low temperature cure version.

ABLEFILM® 561K is designed for substrate attach and heat sink bonding. This adhesive film is designed for bonding materials with severely mismatched coefficients of thermal expansion. All data and results will vary with different thicknesses.

Ablefilm® ECF550 silver filled, epoxy adhesive film is designed for microelectronic applications which require electrical conductivity. When used for substrate attach, ECF550 adhesive film acts as an electrical ground plane. In the assembly or sealing of microelectronic packages which require RF shielding, ECF550 adhesive film maintains electrical continuity between joints. Ablefilm ECF550 adhesive film provides strong adhesion to gold and other difficult-to-bond metals. After exposure to moisture, it retains its bond strength. This adhesive film is also available in a low temperature cure version.

Ablefilm® ECF550S silver filled epoxy adhesive film is designed for microelectronic applications which require electrical conductivity. This adhesive film is supported by a 3.5-mil silver screen carrier. ECF550S adhesive film provides thermal conductivity values of 1.4 to 3.8 W/m°K, depending upon bondline pressure and initial film thickness.

ABLEFILM® ECF550X silver filled, epoxy adhesive film is designed for microelectronic applications which require electrical conductivity. This material exhibits conductivity in the x, y, and z axes. When used for substrate attach, ECF550X acts as an electrical ground plane. It provides RF/EMI shielding.

ABLEFILM® ECF561E electrically conductive die attach adhesive is designed for bonding materials with severely mismatched coefficients of thermal expansion. When used for substrate attach, this adhesive film acts as an electrical ground plane.

Acculam® Epoxyglas G10 nonFR - Laminate sheet comprised of a halogen free epoxy resin binder and a woven fiberglass substrate. It qualifies to NEMA G10 and MIL-I-24768/2. This material exhibits high mechanical strength and electrical insulating qualities under both dry and humid conditions. Its ease of fabrication allows its use in many structural and cryogenic applications where halogenated compounds may be undesirable.

Acculam® Epoxyglas G10/ FR4, is a laminate sheet comprised of a flame retardant epoxy resin and a woven fiberglass substrate. This grade qualifies to NEMA FR4 and MIL-I-24768/27. This material has high mechanical strength and excellent electrical insulating qualities in both dry and humid conditions. These attributes along with good fabricating characteristics allow this grade to be used in a wide variety of electrical and mechanical applications.

Acculam® Epoxyglas G11 nonFR -Laminate sheet comprised of heat resistant/halogen free epoxy resin and a woven fiberglass substrate. It qualifies to NEMA G11 and MIL-I-24768/3 This material exhibits extremely high mechanical strength at elevated temperatures and has good dielectric loss and electric strength properties under both dry and humid conditions. It is resistant to flow, dimensional change, chemicals and has low moisture absorption.

Acculam® Epoxyglas G11/ FR5 -Laminate sheet comprised of flame retardant/heat resistant epoxy resin and a woven fiberglass substrate. It qualifies to NEMA FR5 and MIL-I-24678/28. G11/FR5 material exhibits extremely high mechanical strength at elevated temperatures. It shows good dielectric loss and electric strength properties under both dry and humid conditions. It has good chemical resistance and low moisture absorption.