Type: Epoxy moulding compund, inoganically filled, glass fiber reinforced Suggested uses: Encapsulation of electronics Processes: Injection molding. Compression molding. Benefits: Heat resistant. Improved chemical resistance. Low viscosity. Very good mechanical properties. Very high dimensional stability.

Type: Epoxy moulding compound, inorganically filled, glass fiber reinforced Suggested uses: Lamp holder Processes: Injection molding. Compression molding. Benefits: Heat resistant. Improved electrical properties. Low post shrinkage.

Type: Epoxy moulding compound, inorganically filled, glass fiber reinforced Suggested uses: Encapsulation of electronics Processes: Injection molding. Compression molding. Benefits: Heat resistant. High mechanical strength. Improved chemical resistance. Low viscosity. RTI: 155 °C. UL listed. Very high dimensional stability.

Type: Epoxy moulding compound, mica reinforced Suggested uses: Head lamp sockets Processes: Injection molding. Compression molding. Benefits: Heat resistant. Low viscosity.

Type: Epoxy moulding compund, inoganically filled, glass fiber reinforced Suggested uses: Spark plug connectors. Terminal boards. Processes: Injection molding. Compression molding. Benefits: Heat resistant. Improved chemical resistance. Improved electrical properties.