FUSABOND™ E158 is a anhydride modified polyethylene. Uses - Adhesives; Pipe Coating; Tie-Layer Composition - Medium% By Weight Maleic Anhydride - Graft levels are defined as: - Low < 0.2%; Medium 0.2-0.5%; High 0.5-1.0%; Ultra high > 1.0%

FUSABOND™ E204 is an anhydride modified high density polyethylene. Composition - Ultra High% By Weight Maleic Anhydride - Graft levels are defined as: - Low < 0.2%; Medium 0.2-0.5%; High 0.5-1.0%; Ultra high > 1.0% Applications - Compatibilizer. - Adhesion promoter between polyolefins, and metal, cellulose, glass.

FUSABOND™ E226 is an anhydride modified polyethylene. Uses - Wire & Cable Applications; Polymer Modifier Composition - High% By Weight Maleic Anhydride - Graft levels are defined as: - Low < 0.2%; Medium 0.2-0.5%; High 0.5-1.0%; Ultra high > 1.0%

FUSABOND™ E528 is an anhydride modified polyethylene. Uses - Polymer Modifier Composition - Ultra High% By Weight Maleic Anhydride - Graft levels are defined as: - Low < 0.2%; Medium 0.2-0.5%; High 0.5-1.0%; Ultra high > 1.0%

This data represents typical values that have been calculated from all products classified as: Generic PE, Unspecified - Glass Fiber This information is provided for comparative purposes only.

This data represents typical values that have been calculated from all products classified as: Generic PE, Unspecified - Inorganic This information is provided for comparative purposes only.

This data represents typical values that have been calculated from all products classified as: Generic PE, Unspecified - Titanium Dioxide Equivalent This information is provided for comparative purposes only.

This data represents typical values that have been calculated from all products classified as: Generic PE, Unspecified This information is provided for comparative purposes only.

Suggested Applications Geomembrane and greenhouse film

E8201 is a crosslinkable, strippable semiconductive compound, designed for EPDM rubber insulated cables and use in both dry and steam curing processes. E8201 meets the requirements as below, when optimal processing extrusion and end testing procedure are used: - AEIC CS8 (latest edition) - BS 6622 - IEC 60502 - NF C 33-223 - NEMA WC 7-1996/ICEA S-95-658

Easy Strippable Semiconductive Shielding E8413 is a crosslinkable easy-strippable semiconductive compound, designed for both XLPE and EPDM rubber insulated cables and use in both dry and steam curing processes. Specifications: E8413 meets the requirements as below, when optimal processing extrusion and end testing procedure are used: AEIC-CS 5/94 BS 6622 HN 33-S-23 (EDF) IEC 502 IEC 840 NF CS 32-223 SS 424 14 16, SS424 14 17 (HD 620 S1:1996) VDE 0273 / 12.87

E8572 is a crosslinkable, strippable semiconductive compound, designed for XLPEinsulated cables and use in both dry and steam curing processes. E8572 meets the requirements as below, when optimal processing extrusion and end testing procedure are used: - AEIC- CS 8 (latest edition) - BS 6622 - IECA: 60502 - NF C 33-223 - NEMA WC 7-1996/ICEA S-95-658

E8575-A1 is a crosslinkable, strippable semi-conductive compound, designed for XLPE insulated cables and use in both dry and steam curing processes. E8575-A1 is recommended for Italian, French and Spanish standards on XLPE. Specifications E8575-A1 meets the requirements as below, when optimal processing extrusion and end testing procedure are used: AEIC- CS 8 (latest edition) BS 6622 IECA: 60502 NF C 33-223 NEMA WC 7-1996/ICEA S-95-658

ICORENE® C-420 is a permanent semi-conductive rotational molding polyolefin compound that offers the same degree of static dissipation properties, processability, and UV stability as our C-517, but with higher stiffness.

ICORENE® N7130 is a polyethylene based coating powder designed for encapsulating wire goods. Compared with standard powders, this grade will have improved flow behaviour, process faster and enable users to make savings through thinner coatings achieved at lower oven temperatures. This grade is used for fluidized bed coating applications by manual dip coating.