LNP STAT-KON EX02598C compound is based on Polyetherimide (PEI) resin containing carbon nanotube. Added features of this grade include: LNP Clean Compounding Technology, Electrically Conductive.

LNP STAT-KON EX03319C compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber. Added features of this grade include: LNP Clean Compounding Technology, Low Non-Volatile Residue (NVR), Electrically Conductive

LNP STAT-KON EX07311P compound is based on Polyetherimide (PEI) resin containing carbon fiber (15%), glass fiber (25%) and PTFE. Added features of this grade include: LNP Clean Compounding Technology, Electrically Conductive, Dimensional Stability, Wear Resistant.

LNP STAT-KON EX11318C compound is based on Polyetherimide (PEI) resin containing 30% carbon fiber. Added features of this grade include: LNP Clean Compounding Technology, Low C18-C40 Hydrocarbons, Electrically Conductive, Dimensional Stability.

LNP STAT-KON EX11402R compound is based on Polyetherimide (PEI) resin containing proprietary fillers. Added features of this grade include: Electrically Conductive, Radar Absorbing.

LNP STAT-KON EX12310C compound is based on Polyetherimide (PEI) resin containing 10% carbon fiber. Added features of this grade include: LNP Clean Compounding Technology, Low C18-C40 Hydrocarbons, Electrically Conductive, Dimensional Stability.

LNP STAT-KON EX99689C compound is based on Polyetherimide (PEI) resin containing 10% carbon fiber. Added features of this grade include: LNP Clean Compounding Technology, Electrically Conductive.

LNP STAT-KON UC1200 compound is based on Polyetherimide (PEI) resin containing 12% carbon fiber. Added features of this grade include: Electrically Conductive.

LNP THERMOCOMP EC004EXAR1 compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber designed to provide a Wider Process Window and Easier Flow for Large Format Additive Manufacturing (LFAM) applications needing High heat performance. PEI compounds, based on SABIC's inherently flame-retardant ULTEM™ resins, provide Low Thermal Expansion, High Temperature Performance, Excellent Strength-to-Weight Ratio, High Modulus and Low Creep.

LNP THERMOCOMP EC004XXAR1 is a compound based on Polyetherimide (PEI) resin containing 20% carbon fiber for Large Format Additive manufacturing (LFAM) applications needing higher stiffness vs glass fiber. PEI compounds, based on SABIC's inherently flame-retardant ULTEM™ resins, provide low thermal expansion, high temperature performance, excellent strength-to-weight ratio, high modulus and low creep.

LNP THERMOCOMP EF004XXAR1 is a compound based on Polyetherimide (PEI) resin containing 20% glass fiber for Large Format Additive manufacturing (LFAM) applications. PEI compounds, based on SABIC's inherently flame-retardant ULTEM™ resins, provide low thermal expansion, high temperature performance, excellent strength-to-weight ratio, high modulus and low creep.

LNP THERMOCOMP EZ006EXAR1is a compound based on Polyetherimide (PEI) resin containing 30% milled glass fiber for Large Format Additive manufacturing (LFAM) applications requiring better dimensional stability and low thermal expansion. PEI compounds, based on SABIC's inherently flame-retardant ULTEM™ resins, offer high temperature performance, excellent strength-to-weight ratio, high modulus and low creep.

LNP THERMOCOMP 9X99089 compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.

LNP THERMOCOMP EC004APQ compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive, FAR25.853 Compliant.

LNP THERMOCOMP EC004XXC compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.

LNP THERMOCOMP EC005 compound is based on Polyetherimide (PEI) resin containing 25% carbon fiber. Added features of this grade include: Electrically Conductive.

LNP THERMOCOMP EC005 compound is based on Polyetherimide (PEI) resin containing 25% carbon fiber. Added features of this grade include: Electrically Conductive.

LNP THERMOCOMP EC005 compound is based on Polyetherimide (PEI) resin containing 25% carbon fiber. Added features of this grade include: Electrically Conductive.

LNP THERMOCOMP EC006 compound is based on Polyetherimide (PEI) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive.

LNP THERMOCOMP EC006 compound is based on Polyetherimide (PEI) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive.

LNP THERMOCOMP EC006 compound is based on Polyetherimide (PEI) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive.

LNP THERMOCOMP EC006APQ compound is based on Polyetherimide (PEI) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive, High Flow, FAR25.853 Compliant.

LNP THERMOCOMP EC006AQW compound is based on Polyetherimide (PEI) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive. This grade has been pre-assessed and passed the material related tests from the ISO 10993 “Biological Evaluation of Medical Devices”.

LNP THERMOCOMP EC006E compound is based on Polyetherimide (PEI) resin containing 30% carbon fiber. Added features of this grade include: Easy Molding, Electrically Conductive.

LNP THERMOCOMP EC006PXQ compound is based on Polyetherimide (PEI) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive, Exceptional Processing, FAR25.853 Compliant.

LNP THERMOCOMP EC008 compound is based on Polyetherimide (PEI) resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive.

LNP THERMOCOMP EC008APQ compound is based on Polyetherimide (PEI) resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive, High Flow. FAR25.853 Compliant.

LNP THERMOCOMP EC008PXQ compound is based on Polyetherimide (PEI) resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive, Exceptional Processing, FAR25.853 Compliant.

LNP THERMOCOMP ECF62 compound is based on Polyetherimide (PEI) resin containing 30% glass fiber, 10% carbon fiber. Added features of this grade include: Electrically Conductive.

LNP THERMOCOMP EF002EXH compound is based on Polyetherimide (PEI) resin containing 10% glass fiber. Added features of this grade include: Healthcare.

LNP THERMOCOMP EF004 compound is based on Polyetherimide (PEI) resin containing 20% glass fiber.

LNP THERMOCOMP EF004XXP compound is based on Polyetherimide (PEI) resin containing 20% glass fiber. Added features of this grade include: High Modulus, High Strength, Good Dimension Stability and Good Warpage Control.

LNP THERMOCOMP EF006 compound is based on Polyetherimide (PEI) resin containing 30% glass fiber.

LNP THERMOCOMP EF006 compound is based on Polyetherimide (PEI) resin containing 30% glass fiber.

LNP THERMOCOMP EF006ER compound is based on Polyetherimide (PEI) resin containing 30% glass fiber. Added features of this grade include: Easy Molding, Mold Release.

LNP THERMOCOMP EF006H compound is based on Polyetherimide (PEI) resin containing 30% glass fiber. Added features of this grade include: Healthcare.

LNP THERMOCOMP EFB26ER compound is based on Polyetherimide (PEI) resin containing 30% glass fiber, 10% glass bead. Added features of this grade include: Easy Molding, Mold Release.

LNP THERMOCOMP EX00781H is a compound is based on Polyetherimide (PEI) resin containing 20% glass fiber. Added features of this grade include: Healthcare.

LNP THERMOCOMP EX06430H compound is based on Polyetherimide (PEI) resin containing mineral. Added features of this grade include: Healthcare, X-Ray Detectable.

LNP THERMOCOMP EX11414 compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive, FAR25.853 Compliant.