LNP THERMOCOMP EC004EXAR1 compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber designed to provide a Wider Process Window and Easier Flow for Large Format Additive Manufacturing (LFAM) applications needing High heat performance. PEI compounds, based on SABIC's inherently flame-retardant ULTEM™ resins, provide Low Thermal Expansion, High Temperature Performance, Excellent Strength-to-Weight Ratio, High Modulus and Low Creep.

LNP THERMOCOMP EC004XXAR1 is a compound based on Polyetherimide (PEI) resin containing 20% carbon fiber for Large Format Additive manufacturing (LFAM) applications needing higher stiffness vs glass fiber. PEI compounds, based on SABIC's inherently flame-retardant ULTEM™ resins, provide low thermal expansion, high temperature performance, excellent strength-to-weight ratio, high modulus and low creep.

LNP THERMOCOMP EF004XXAR1 is a compound based on Polyetherimide (PEI) resin containing 20% glass fiber for Large Format Additive manufacturing (LFAM) applications. PEI compounds, based on SABIC's inherently flame-retardant ULTEM™ resins, provide low thermal expansion, high temperature performance, excellent strength-to-weight ratio, high modulus and low creep.

LNP THERMOCOMP EZ006EXAR1is a compound based on Polyetherimide (PEI) resin containing 30% milled glass fiber for Large Format Additive manufacturing (LFAM) applications requiring better dimensional stability and low thermal expansion. PEI compounds, based on SABIC's inherently flame-retardant ULTEM™ resins, offer high temperature performance, excellent strength-to-weight ratio, high modulus and low creep.