LNP THERMOCOMP 9X11428J compound is based on Polyphenylsulfone (PPSU) containing proprietary filler. Added features of this grade include: Healthcare, Low Extractables, Food Contact compliant.

LNP THERMOCOMP OC006 compound is based on linear Polyphenylene Sulfide (PPS) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive.

LNP THERMOCOMP OC006 compound is based on linear Polyphenylene Sulfide (PPS) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive.

LNP THERMOCOMP OC006 compound is based on linear Polyphenylene Sulfide (PPS) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive.

LNP THERMOCOMP OCF62E compound is based on linear Polyphenylene Sulfide (PPS) resin containing 10% carbon fiber, 30% glass fiber. Added features of this grade include: Electrically Conductive, Easy Molding

LNP THERMOCOMP OF006 compound is based on linear Polyphenylene Sulfide (PPS) resin containing 30% glass fiber.

LNP THERMOCOMP OF006A compound is based on branched Polyphenylene Sulfide (PPS) resin containing 30% glass fiber.

LNP THERMOCOMP OF006A compound is based on branched Polyphenylene Sulfide (PPS) resin containing 30% glass fiber.

LNP THERMOCOMP OF008 compound is based on linear Polyphenylene Sulfide (PPS) resin containing 40% glass fiber.

LNP THERMOCOMP OF008A compound is based on branched Polyphenylene Sulfide (PPS) resin containing 40% glass fiber.

LNP THERMOCOMP OF008A compound is based on branched Polyphenylene Sulfide (PPS) resin containing 40% glass fiber.

LNP THERMOCOMP OF008A compound is based on branched Polyphenylene Sulfide (PPS) resin containing 40% glass fiber.

LNP THERMOCOMP OF008AE compound is based on branched Polyphenylene Sulfide (PPS) resin containing 40% glass fiber. Added features of this grade include: Easy Molding.

LNP THERMOCOMP OF008E compound is based on linear Polyphenylene Sulfide (PPS) resin containing 40% glass fiber. Added features of this grade include: Easy Molding.

LNP THERMOCOMP OF008E compound is based on linear Polyphenylene Sulfide (PPS) resin containing 40% glass fiber. Added features of this grade include: Easy Molding.

LNP THERMOCOMP OF008E compound is based on linear Polyphenylene Sulfide (PPS) resin containing 40% glass fiber. Added features of this grade include: Easy Molding.

LNP THERMOCOMP OF008G compound is based on linear Polyphenylene Sulfide (PPS) resin containing 15% glass fiber, 25% milled glass.

LNP THERMOCOMP OF008H compound is based on linear Polyphenylene Sulfide (PPS) resin containing 40% glass fiber. Added features of this grade include: Healthcare.

LNP THERMOCOMP OF00AN compound is based Polyphenylene Sulfide (PPS) containing 50% glass fiber. Added features include: High Modulus, Impact Modified, Low Chloride content, Good Warpage Control, Inherently Flame Retardant. Excellent High Heat and Chemical Resistance and Good Metal Bonding Strength targeted for Nano-Molding Technology (NMT) applications.

LNP THERMOCOMP OFC08 compound is based on Polyphenylene sulfide (PPS) resin containing 40% glass fiber. Added features of this grade include: High Modulus and Strength, Good Impact Strength and Ductility, Excellent Heat and Chemical Resistance, Good Electrical properties and Inherently Flame-Retardant. It is also an Easy Flow grade with Good Flash Control. Applications of this grade include electric and electronic components, and various parts requiring high strength and high heat resistant.

LNP THERMOCOMP OFC08V is a glass fiber reinforced Polyphenylene sulfide (PPS) compound. Added features include: high heat and chemical resistance, good warpage control and inherently flame-retardant, low flash and good processability, excellent LDS capability and plating performance, stable dielectric properties at various temperatures. Applications of this grade include 5G infrastructure and electronic components.

LNP THERMOCOMP OFC08XXP compound is a 40% glass fiber reinforced polyphenylene sulfide. Added feature of this material include: High stiffness/strength, High flow, Low warpage, Impact resistant, Chemical resistance.

LNP THERMOCOMP OFM46 compound is based on Polyphenylene Sulfide (PPS) containing 50% glass fiber and minerals. Added features of this material include: high stiffness and strength, excellent dimensional stability and warpage control, good flame and chemical resistance, low coefficient of thermal expansion and moisture absorption.

LNP THERMOCOMP OMC0D compound is a mineral reinforced polyphenylene sulfide. Added feature of this material include: high dielectric constant, low dissipation factor, good flame and chemical resistance, low moisture absorption.

LNP THERMOCOMP OMC0E compound is a mineral reinforced polyphenylene sulfide. Added feature of this material include: high dielectric constant, low dissipation factor, good flame and chemical resistance, low moisture absorption.