LNP THERMOCOMP GF003 compound is based on Polysulfone (PSU) resin containing 15% glass fiber.

LNP THERMOCOMP GF004 compound is based on Polysulfone (PSU) resin containing 20% glass fiber.

LNP THERMOCOMP GF004 compound is based on Polysulfone (PSU) resin containing 20% glass fiber.

LNP THERMOCOMP GF004 compound is based on Polysulfone (PSU) resin containing 20% glass fiber.

LNP THERMOCOMP GF006 compound is based on Polysulfone (PSU) resin containing 30% glass fiber.

LNP THERMOCOMP GF006 compound is based on Polysulfone (PSU) resin containing 30% glass fiber.

LNP THERMOCOMP GX94043L compound is based on Polysulfone (PSU) resin containing mineral. Added features of this grade include: Low Extractables.

LNP THERMOCOMP GZ004 compound is based on Polysulfone (PSU) resin containing 20% milled glass.

LNP THERMOCOMP JF002 compound is based on Polyethersulfone (PES) resin containing 10% glass fiber.

LNP THERMOCOMP JF002 compound is based on Polyethersulfone (PES) resin containing 10% glass fiber.

LNP THERMOCOMP JF002 compound is based on Polyethersulfone (PES) resin containing 10% glass fiber.

LNP THERMOCOMP JF002R compound is based on Polyethersulfone (PES) resin containing 10% glass fiber/glass bead. Added features of this grade include: Mold Release.

LNP THERMOCOMP JF003E compound is based on Polyethersulfone (PES) resin containing 15% glass fiber. Added features of this grade include: Easy Molding.

LNP THERMOCOMP JF004 compound is based on Polyethersulfone (PES) resin containing 20% glass fiber.

LNP THERMOCOMP JF004 compound is based on Polyethersulfone (PES) resin containing 20% glass fiber.

LNP THERMOCOMP JF004 compound is based on Polyethersulfone (PES) resin containing 20% glass fiber.

LNP THERMOCOMP JF004E compound is based on Polyethersulfone (PES) resin containing 20% glass fiber. Added features of this grade include: Easy Molding.

LNP THERMOCOMP JF004E compound is based on Polyethersulfone (PES) resin containing 20% glass fiber. Added features of this grade include: Easy Molding.

LNP THERMOCOMP JF004E compound is based on Polyethersulfone (PES) resin containing 20% glass fiber. Added features of this grade include: Easy Molding.

LNP THERMOCOMP JF004EXP compound is based on Polyethersulfone (PES) resin containing 20% glass fiber. Added features of this grade include: Easy Molding.

LNP THERMOCOMP JF004L compound is based on Polyethersulfone (PES) resin containing 20% glass fiber. Added features of this grade include: Low Extractables

LNP THERMOCOMP JF004RXP compound is based on Polyethersulfone (PES) resin containing glass fiber. Added features of this grade include: Mold Release.

LNP THERMOCOMP JF004Z compound is based on Polyethersulfone (PES) resin containing 20% glass fiber. Added features of this grade include: High Viscosity, suitable for Extrusion.

LNP THERMOCOMP JF006 compound is based on Polyethersulfone (PES) resin containing 30% glass fiber.

LNP THERMOCOMP JF006 compound is based on Polyethersulfone (PES) resin containing 30% glass fiber.

LNP THERMOCOMP JF006E compound is based on Polyethersulfone (PES) resin containing 30% glass fiber. Added features of this grade include: Easy Molding.

LNP THERMOCOMP JF006E compound is based on Polyethersulfone (PES) resin containing 30% glass fiber. Added features of this grade include: Easy Molding.

LNP THERMOCOMP JF006EXZ compound is based on Polyethersulfone (PES) resin containing 30% glass fiber. Added features of this grade include: Easy Molding.

LNP THERMOCOMP JF006LXZ compound is based on Polyethersulfone (PES) resin containing 30% glass fiber. Added features of this grade include: Low Extractables.

LNP THERMOCOMP JF006LZZ compound is based on Polyethersulfone (PES) resin containing 30% glass fiber. Added features of this grade include: Extrusion grade, Low Extractables.

LNP THERMOCOMP JX97000 compound is based on Polyethersulfone (PES) resin containing 30% glass fiber. Added features of this grade include: Mold Release.