CONAP AD-1146 and CONAP AD-1147 are high-strength adhesives for bonding liquid urethanes to various substrates during the curing process. These systems are stable solutions of polymers in a solvent blend and require heat to affect cure. An extensive evaluation program has shown CONAP AD-1146 and CONAP AD-1147 to be capable of bonding an exceptional variety of inorganic and organic materials together. Bonds to aluminum alloys, magnesium, iron, steel, glass, glass-fiber laminates, wood, and leather have high strength and excellent resistance to hydrolysis and environmental extremes. CONAP AD-1146-C and AD-1147-C are based on the same formulations as CONAP AD-1146 and CONAP AD-1147, with lower solids content and lower viscosity. They too offer exceptional peel strength values, however CONAP AD-1146-C and AD-1147-C require two coats for optimum strength.

CONAP AD-6404 is a two-component, unfilled, low viscosity polyurethane resin system designed for use in biomedical applications.

CONAP AD-6405 is a two-component, non-TDI, liquid polyurethane casting system produced under very carefully controlled conditions. This elastomeric system features excellent toughness, water resistance, and physical properties. CONAP AD-6405 is recommended as a general purpose potting compound, sealant, or adhesive for medical applications, particularly where good penetration, hydrolytic stability, low exotherm, low shrinkage, and good cutting properties are required.

CONAP AD-6406 is a two-component urethane system designed for use as a sealant.

CONAP AD-6407 is a two-component thixotropic urethane system designed for use as a sealant.

CONAP AD-6408 is a two-component polyurethane system formulated for filter sealant applications. CONAP AD-6408 exhibits superior penetration of filter media substrates and is based on components that are FDA an NSF approvable.

CONAP AD-6409 is a two-component polyurethane system formulated for filter sealant applications. CONAP AD-6409 exhibits superior penetration of filter media substrates and is based on components that are FDA an NSF approvable.

CONAP AD-6410 is a two-component polyurethane system formulated for filter sealant applications. CONAP AD-6410 is based on components that are FDA and NSF approvable, and exhibits outstanding resistance to hot NaOH cleaning solutions as well as superior penetration of filter media substrates.

CONAP AD-6411 is a two-component polyurethane system formulated for filter sealant applications.

CONAP AD-6412 is a two-component polyurethane system formulated for filter sealant applications. CONAP AD-6412 is based on components that are FDA an NSF approvable, and exhibits outstanding resistance to hot NaOH cleaning solutions as well as superior penetration of filter media substrates.

CONAP EN-5310 is a two-component liquid polyurethane resin system formulated for low durometer encapsulating applications. Designed to meet the demanding requirements of moisture resistance and vibration absorption, this system will produce different hardnesses based on the mix ratio used.

CONAP EN-5320 is a filled two-component polyurethane system designed for use as a potting and encapsulating material for electronic components where critical thermal cycling characteristics are a factor. CONAP EN-5320 has excellent electrical properties, low shrinkage, low stress build-up, and can be hand mixed or machine dispensed

CONAP EN-5322 is a filled, flame resistant polyurethane resin formulated for general purpose electrical/electronic potting, casting, and encapsulation. When tested in accordance with UL-94, flame resistance ratings of 94V-0 were obtained. CONAP EN-5322 has excellent handling properties at room temperature. Cure can be accomplished at room or elevated temperatures.

CONAP EN-5330 is halogen free based on IEC 61249-2-21 CONAP EN-5330 is a filled two-component polyurethane system designed for use as a potting and encapsulating material for electronic components where critical thermal cycling characteristics are a factor. CONAP EN-5330 has excellent electrical properties, low shrinkage, low stress build-up, and can be hand mixed or machine dispensed.

CONAP EN-5850 is a fast gelling, filled, flame-retardant, two-component polyurethane system formulated for potting and encapsulating electrical and electronic components, modules, circuit boards, assemblies, and related devices.

CONAP EN-5851 is a filled, flame-retardant, two-component polyurethane system formulated for potting and encapsulating electrical and electronic components, modules, circuit boards, assemblies, and related devices.

CONAP EN-5852 is a filled, flame-retardant, two-component polyurethane system formulated for potting and encapsulating electrical and electronic components, modules, circuit boards, assemblies, and related devices.