Commercial: Active

Africa & Middle East, Asia Pacific, Europe, Latin America, North America

Also Available In, Density / Specific Gravity, Density, Apparent (Bulk) Density, Melt Mass-Flow Rate (MFR), Melt Mass-Flow Rate (MFR), Melt Volume-Flow Rate (MVR), Mold Shrink, Linear-Flow, Mold Shrink, Linear-Trans, Molding Shrinkage, Water Absorption @ 24 hrs, Water Absorption 24h/23C, Water Absorption @ Sat., Water Absorption Sat/23C, Water Absorption @ Equil, Water Absorption 23C/50RH, Tensile Modulus, Tensile Modulus, Tensile Strength, Tensile Strength at Yield, Tensile Stress at Yield, Tensile Strength at Break, Tensile Stress at Break, Tensile Stress, Tensile Elongation at Yield, Tensile Strain at Yield, Tensile Elongation at Break, Tensile Strain at Break, Nominal Tensile Strain at Break, Tensile Creep Modulus 1h, Tensile Creep Modulus 1000h, Flexural Modulus, Flexural Modulus, Flexural Strength, Flexural Stress, Flexural Strength at Yield, Compressive Strength, Compressive Stress, Poisson's Ratio, Coefficient of Friction, Taber Abrasion Resistance, Wear Factor, Charpy Notched Impact Strength, Charpy Unnotched Impact Strength, Notched Izod Impact, Notched Izod Impact Strength, Unnotched Izod Impact, Unnotched Izod Impact Strength, Rockwell Hardness, Rockwell Hardness, Shore Hardness, Ball Indentation Hardness, DTUL (66 psi) - Unannealed, DTUL (0.45 MPa) Unannealed, DTUL (264 psi) - Unannealed, DTUL (1.80 MPa) Unannealed, Continuous Use Temperature, Vicat Softening Temperature, Vicat Softening Temperature, Peak Melting Temperature, Melting Temperature (DSC), Melting Temperature, Melting Temperature, Melting Temperature, CLTE, Flow, CLTE, Flow (TMA), Coefficient of Linear Thermal Expansion, Flow, Coefficient of Linear Thermal Expansion, Transverse, Specific Heat, Thermal Conductivity, RTI Str, Surface Resistivity, Surface Resistivity, Surface Resistivity, Volume Resistivity, Volume Resistivity, Volume Resistivity, Dielectric Strength, Electric Strength, Dielectric Constant, Dielectric Constant, Relative Permittivity, Dissipation Factor, Dissipation Factor, Arc Resistance, Melt Density, Melt Specific Heat, Melt Thermal Conductivity, Ejection Temperature, Drying Temperature, Drying Time, Suggested Max Moisture, Hopper Temperature, Rear Temperature, Middle Temperature, Front Temperature, Nozzle Temperature, Processing (Melt) Temp, Mold Temperature, Injection Pressure, Holding Pressure, Back Pressure, Screw Speed, Injection Notes, Melt Temperature, Extrusion Notes