20-3060 is a general purpose, low viscosity epoxy potting and encapsulating resin system. This is a 100% solids system. It therefore does not contain any solvents.

20-3060 is a filled system resulting in excellent dimensional stability and extremely low shrinkage. 20-3060 is characterized by exceptional resistance to impact, vibration, and hermal shock. In addition, this versatile resin system is machinable and ideal for use with meter mix dispensing equipment.

Due to its high purity, 20-3060 offers the ultimate in physical, thermal and electrical insulation properties. The cured polymer exhibits excellent resistance to chemicals, moisture, solvents and environmental exposure.

20-3060 is recommended for applications requiring the optimum in over-all properties and where rigid or flexible wire leads protrude directly from the encapsulant. This system eliminates microscopic cracking when leads are flexed. It also adheres extremely well to lead materials, such as vinyl, neoprene, natural rubber, etc...

20-3060 has found wide acceptance as an encapsulant for applications such as transformers, coils, chokes, solenoids, resistors, modules, microcircuitry, resistors, capacitors, etc... 20-3060 has been formulated for ease in handling and its low viscosity aids in pouring, filling voids and air pockets. In addition, the fillers in 20-3060 have been dispersed to minimize any heavy settling.