20-3301 is a two component epoxy resin system that provides a long working time and easy to use 1:2 mix ratio. Its low viscosity is ideal for many potting, sealing, encapsulating, and casting applications. 20-3301 is an electronic grade system designed to protect devices with outstanding thermal shock, vibration absorption, and thermal cycling properties. This epoxy system passes the Navy Hex Bar Test, MIL-I-16923C, consisting of 10 cycles from -55 to +155°C.

20-3301 is superior to most room temperature curing epoxies in terms of chemical resistance, wide service temperature range, electrical insulation, and overall physical properties. It is typically cured at 80°C for 1-2 hours; however a post cure of 150°C for 3 hours will enhance performance properties.

Applications for 20-3301 include electronic potting and encapsulating, casting, coating, and electrical varnishes. This epoxy system is a good choice for high temperature applications that require a material that is not rigid and brittle.

Features:

• Toughness over a wide temperature range

• Thermal shock resistance

• Long working time

• Chemical resistance

• RoHS and REACH compliant

• DOT Non-Hazardous

• Unfilled with easy to use mix ratio