Techsil EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. The mixed system has a long usable life and may be hot or cold cured. The system exhibits a good surface finish, high electrical strength, excellent thermal conductivity and low cure shrinkage. EP25485 is compatible with most circuit board components and materials over a wide temperature range. Adhesion is excellent to most plastics and substrates. The combination of properties and the ease of use of the material will lend itself to a wide range of applications. The flame-retardants in EP25485 are of a non-halogen type and do not contain heavy metals. It is available in bulk, kits and twinpack form. The standard colour is Black but other colours are available on request.

Features:

• Excellent thermal conductivity

• High electrical insulating characteristics

• Non-toxic

• Low shrinkage

• High adhesion

• Flame retardant to UL94-V0

• Good chemical and water resistance

• RoHS and WEEE compliant