DESCRIPTION Cosmic E484 is a mineral filled, glass reinforced, electrical grade epoxy molding compound which is supplied in a granular form. FEATURES It has excellent mechanical strength and electrical properties, especially at high temperatures. It has passed NASA out-gassing tests. APPLICATIONS Used in electrical hardware applications such as underwater connectors and other insulation applications.

DESCRIPTION Cosmic E484-FDA is a mineral filled, glass reinforced, electrical grade epoxy molding compound which is supplied in a granular form. E484-FDA has been approved for direct food contact use. FEATURES It has excellent mechanical strength and electrical properties, especially at high temperatures. It has passed NASA out gassing tests. APPLICATIONS Used in electrical hardware applications such as underwater connectors and other insulation applications.

DESCRIPTION Cosmic E4920 is a mineral filled epoxy molding compound which is available either in a granular form, or preformed in a variety of sizes and weights. FEATURES It has excellent moisture resistance, thermal cycling stability and outstanding moldability. Parts molded from this material do not support fungus growth. It is available in a wide flow range to suit custom molding requirements. E4920 can be supplied in black, gold, green or red. It has a shelf life of six months when stored at 5°C. APPLICATIONS It is designed for encapsulation of passive devices such as capacitors, inductors, diodes and rectifiers.

DESCRIPTION Cosmic E4920D is a mineral filled epoxy molding compound which is available either in a granular form, or preformed in a variety of sizes and weights. FEATURES It has excellent moisture resistance, thermal cycling stability and outstanding moldability. Parts molded from this material do not support fungus growth. It is available in a wide flow range to suit custom molding requirements. E4920D can be supplied in black, gold, green or red. It has a shelf life of eight months when stored at 5°C. APPLICATIONS It is designed for encapsulation of passive devices such as capacitors, inductors, diodes and rectifiers.

DESCRIPTION Cosmic E4920FC is a mineral filled epoxy molding compound which is available either in a granular form, or preformed in a variety of sizes and weights. FEATURES It has excellent moisture resistance, thermal cycling stability and outstanding moldability. Parts molded from this material do not support fungus growth. It is available in a wide flow range to suit custom molding requirements. E4920FC can be supplied in black, gold, green or red . It has a shelf life of eight months when stored at 5°C. APPLICATIONS It is designed for encapsulation of passive devices such as capacitors, inductors, diodes and rectifiers.

DESCRIPTION Cosmic E4930R is a mineral filled, application specific epoxy molding compound which is supplied in a granular form. FEATURES It has excellent moisture resistance and thermal cycling stability. Standard spiral flow range is 30-40" (EMMI) at 160°C and 1000 psi, and a flow duration of 40-50 seconds at 325 - 1000 psi. It has a hot plate gel time of 35-45 seconds at 160°C. APPLICATIONS Used to encapsulate optocouplers, capacitors, resistors, resistor networks, transistors, SOIS's and QFP.

DESCRIPTION Cosmic E4940P is a mineral filled, glass reinforced epoxy molding compound which is supplied in a granular form. FEATURES It has excellent dimensional stability, improved thermal cycling and exceptional moisture resistance. Standard spiral flow range is 25-35" (EMMI) at 150°C and 1000 psi. It has a hot plate gel time of 22-30 seconds at 160°C, and 18-26 seconds at 182°C. It has a shelf life of eight months when stored at 5°C. APPLICATIONS It is designed for use in high-volume encapsulation of resistor networks and fiber-optic connectors requiring high quality, reliability and good moldability.

DESCRIPTION Cosmic E4940S is a mineral filled epoxy molding compound which is supplied in a granular form. FEATURES It has excellent dimensional stability, improved thermal cycling and exceptional moisture resistance. Standard spiral flow range is 25-35" (EMMI) at 150°C and 1000 psi. It has a hot plate gel time of 22-30 seconds at 160°C, and 18-26 seconds at 182°C. It has a shelf life of eight months when stored at 5°C. APPLICATIONS It is designed for use in high-volume encapsulation of resistor networks and fiber-optic connectors requiring high quality, reliability and good moldability.