E-16521A is an encapsulation grade epoxy molding compound suitable for electrical applications such as coils.

E 264H is a high strength, long fiberglass reinforced epoxy molding compound, which features improved flow in transfer molding.

E 2748-9641D is a mineral and short fiberglass filled epoxy molding compound.

E 2748A is a glass reinforced epoxy molding compound, with good impact strength combined with soft flow for the encapsulation of devices requiring high quality and thermal shock resistance.

E 3812M-1 is a mineral and short fiberglass filled epoxy molding compound for low pressure encapsulation molding, featuring excellent dimensional stability, good thermal shock resistance, and good electrical insulation properties

E 3938A is a fiberglass reinforced epoxy molding compound, with excellent dimensional stability, good strength, and excellent electrical insulation properties.

EM 7459A is a medium strength fiberglass reinforced epoxy molding compound, which features enhanced impact strength and toughness

E 8353-706R is a fiberglass and mineral reinforced epoxy molding compound, with excellent dimensional stability and good strength at elevated temperatures.

E 8354-19189-2 is a glass and mineral reinforced epoxy molding compound, formulated for the encapsulation of devices requiring high quality and thermal shock resistance.

E 8354A-1 is a fiberglass and mineral reinforced epoxy molding compound, with excellent dimensional stability, good electrical insulation properties, and good strength.

E 8354A-2 is a fiberglass and mineral reinforced epoxy molding compound, with excellent dimensional stability, good electrical insulation properties, and good strength.

E 8398 is a fiberglass and mineral reinforced epoxy molding compound, with excellent dimensional stability, good electrical insulation properties, and good strength.

E 8701A is a fiberglass and mineral reinforced epoxy molding compound, with excellent dimensional stability and good strength at elevated temperatures.

E 8940SG is a mineral reinforced epoxy molding compound, formulated for the encapsulation of electronic devices requiring high quality, exceptional reliability, and outstanding moldability. Typical applications include passive electronics, RC networks and rectifiers.

E-9504H-1 is glass fiber filled epoxy molding compound designed for encapsulation of delicate electrical components as well as large coils. Excellent thermal shock, moldability, and retention of electrical properties under humid conditions are the outstanding features of this material.

EM 7302 is a long fiberglass reinforced epoxy molding compound, which features high strength and toughness for structural components. This compound is designed for applications requiring Mil-M-46069 certification

EM 7302LD-2 is a long fiberglass reinforced epoxy molding compound with a low density inert filler. This compound is designed for applications where moderate strength and weight savings are desirable.

EM 7302XLD is a long fiberglass reinforced epoxy molding compound with a low density inert filler. This compound is designed for applications where moderate strength and weight savings are desirable.

EM 7400-2 is a polyaramide fiber reinforced epoxy molding compound, which features abrasion resistance and light weight.

TEM 9053C is a short fiberglass reinforced, toughened epoxy molding compound, with excellent dimensional stability, high strength properties and good electrical insulation properties.