KL-G800H CD epoxy molding compound is suitable for thin leaded package. This material is designed to achieve JEDEC Level 2 requirements, at 260°C reflow temperature.

Hysol® KL-G900HP epoxy molding compound contains no bromine, antimony or phosphorus flame retardant. This material is designed to achieve JEDEC Level 1 requirements, at 260°C reflow temperature. Hysol® KL-G900HP offers enhanced reliability peformance for large QFN packages. KL-G900HP meets UL 94 V-0 Flammability at 3.175mm thickness. Product Benefits - Green product - Low wire sweep molding - Low warpage

UV8800M™ epoxy encapsulant is developed to meet high temperature thermal cycling specifications. It offers a hard translucent coating when exposed to UV light of sufficient intensity. The curing of the product is not inhibited by oxygen, resulting in excellent surface cure. Its viscosity characteristics and dearated condition make it suitable for accurate dispensing with excellent shape control.