LOCTITE® 3118™ cures rapidly at relatively low temperature and provides excellent adhesion on a wide range of substrates. Typical applications include Memory cards, CCD/CMOS Assemblies.

Loctite 3119™ cures rapidly at relatively low temperature and provides excellent adhesion on a wide range of substrates. Typical applications include the assembly of electronics components which are heat sensitive.

LOCTITE® 3129™ is a one part, heat curable epoxy. This product is designed to cure at low temperature and gives excellent adhesion on a wide range of materials in considerably short time. Typical applications include Memory cards, CCD/CMOS Assemblies. Particularly suited where low curing temperatures are required for heat sensitive components.

LOCTITE 3329 has been developed for encapsulation of wire bonded dies, used for Smartcard IC modules. It is designed for use only with Hysol® UV dam encapsulants, such as Hysol® 3323™. This combination of dam and fill will pass mechanical stress testing and high reliability tests; typically thermal shock cycling -55°C to +125°C and humidity heat aging 85°C / 85% RH.

LOCTITE® A-304-29 is single component, pourable heat cure epoxy with excellent thermal stability and resistance to many chemicals. The product is especially useful for high strength bonding of assemblies that are exposed to severe chemical environments.

LOCTITE® A-316-30 is single component, thixotropic (non-sag rheology), heat cure epoxy with excellent thermal stability and resistance to many aggressive and harsh chemicals. The product is suitable for use as an end cap adhesive for filters exposed to many aggressive fluids. TYPICAL APPLICATIONS - Bonding and Sealing Components Exposed to Harsh Chemical environments - Filter End-Cap Adhesive / Sealer - Battery Component Bonding - Compressor Component Bonding

LOCTITE® EA 193124 / EA 193125™ is a low viscosity adhesive that can be gelled to a tack free, non-flow state with a few seconds of exposure to moderate UV light and then fully cured at room temperature or rapidly at elevated temperatures. The fully cured system develops strong, tough, high performance bonds to metals, ceramics, phenolics, polyesters, epoxies, urethanes and many other plastics. LOCTITE® EA 193124 / EA 193125™ is a durable, electrically insulating adhesive that provides good resistance to gases, vapors, petroleum solvents, fuels, salt solutions, mild acids and alkalis.

LOCTITE® EA E-30CL™ is a low viscosity, industrial grade epoxy adhesive. Once mixed, the two component epoxy cures at room temperature with minimal shrinkage to form an ultra clear adhesive bondline with excellent impact resistance. The fully cured epoxy is resistant to a wide range of chemicals and solvents and has excellent dimensional stability over a wide temperature range. Typical applications include bonding, small potting, staking and laminating applications where optical clarity and excellent structural, mechanical and electrical insulating properties are required. LOCTITE® EA E-30CL™ bonds most materials including glass, optical fibers, ceramics, metals, and many rigid plastics.

Loctite® EA E-40EXP™ is a two component, self-leveling epoxy designed for potting electric motors. Once mixed, the two component epoxy cures at room temperature. It can be potted into horizontal volumes and will flow to fill the voids. Typical applications include the potting of wire conduits to isolate the electrical motor from the surrounding environment.

LOCTITE® EA E-60NC is a flowable, industrial grade epoxy potting compound with extended work life. Once mixed, the two-part epoxy cures at room temperature to form a rigid, black encapsulant that is non-corrosive to metallic components on PC Boards and electronic assemblies. The fully cured epoxy provides excellent environmental and chemical resistance, and acts as an electrical insulator. TYPICAL APPLICATIONS Designed for bonding, potting and encapsulating electrical components which are sensitive to corrosion. Used in electronic applications, for component attachment to boards, housing assembly and potting.

LOCTITE EO7029 encapsulant is formulated for use in smart card applications. The thixotropic property of this material is designed to avoid flow during cure.

LOCTITE HYSOL GR 15F-1P is an anhydride cured molding compound containing spherical filler designed for those applications requiring high voltage, high power and/or high temperature performance.

LOCTITE HYSOL GR 2220 epoxy molding compound delivers outstanding performance and ease of use. Product Benefits - Green product - Environmentally friendly - High moldability - Fast cycle time

LOCTITE HYSOL GR 2310 epoxy molding compound delivers outstanding performance and ease of use.

LOCTITE HYSOL GR 2320 epoxy molding compound delivers outstanding performance and ease of use.

LOCTITE HYSOL GR 2710 epoxy molding compound delivers outstanding performance and ease of use. LOCTITE HYSOL GR 2710 meets UL 94 V-0 Flammability at 6.35mm thickness. Product Benefits - Green product - Low stress - High Tg - High flexural strength - Mold at low temperatures - Fast cycle time

LOCTITE HYSOL GR 2720 is a green epoxy based molding compound designed for the encapsulation of passive components. This material is an excellent candidate for the molding of pressure sensitive components. LOCTITE HYSOL GR 2720 meets UL 94 V-0 Flammability at 6.35mm thickness. Product Benefits - Green product - Low stress - High Tg - High strength - Mold at low temperatures - Fast cycle time

LOCTITE HYSOL GR 2725 is a green epoxy based molding compound designed for the encapsulation of passive components. This material is an excellent candidate for the molding of pressure sensitive components. LOCTITE HYSOL GR 2725 meets UL 94 V-0 Flammability at 6.35mm thickness. Product Benefits - Green product - Low stress - High Tg - High strength - Mold at low temperatures - Fast cycle time

LOCTITE HYSOL GR 2811 epoxy molding compound delivers outstanding performance and ease of use. This material is designed to achieve JEDEC Level 1 requirements, at 260°C reflow temperature.

LOCTITE HYSOL GR 640HV-L1 epoxy molding compound delivers outstanding performance and ease of use. This material is designed to achieve JEDEC Level 1 requirements, at 260°C reflow temperature.

LOCTITE HYSOL GR 725LV is a semiconductor grade molding compound designed for power package applications. This material is designed to achieve high JEDEC MSL requirements, at 260°C reflow temperature.

LOCTITE HYSOL GR 9810-1P is a state of the art epoxy molding compound developed to meet the stringent encapsulation requirements of package on package (POP and SCSP). It significantly increased beyond that of standard green compound chemistry.

LOCTITE HYSOL KL 1000-3LX provides the lowest cost of ownership with superior moldability and reliability. This material is designed to achieve JEDEC Level 4 requirements, at 220°C reflow temperature.

LOCTITE HYSOL KL 4500-1NT epoxy molding compound delivers outstanding performance and ease of use. This material is designed to achieve JEDEC Level 1 requirements, at 260°C reflow temperature.

LOCTITE HYSOL KL 5000-HT epoxy molding compound delivers outstanding performance and ease of use.

LOCTITE HYSOL KL 6500S epoxy molding compound delivers outstanding performance and ease of use. This material is designed to achieve JEDEC Level 1 requirements, at 260°C reflow temperature.

LOCTITE HYSOL KL 7000HA epoxy molding compound delivers outstanding performance and ease of use. This material is designed to achieve JEDEC Level 3 requirements, at 260°C reflow temperature.

LOCTITE HYSOL KL G150 epoxy molding compound contains no bromine, antimony or phosphorus flame retardant. This material is designed to achieve JEDEC Level 3 requirements, at 260°C reflow temperature. LOCTITE HYSOL KL G150 provides the lowest cost of ownership with superior moldability and reliability. Product Benefits - Green product - High moldability - High reliability - Low cost of ownership

LOCTITE HYSOL KL G450H epoxy molding compound contains no bromine, antimony or phosphorus flame retardant. This material is designed to achieve JEDEC Level 3 requirements, at 260°C reflow temperature for a QFP package. LOCTITE HYSOL KL G450H meets UL 94 V-0 Flammability at 3.175mm thickness. Product Benefits - Green product - Low stress - High reliability

LOCTITE HYSOL KL G450S epoxy molding compound contains no bromine, antimony or phosphorus flame retardant. LOCTITE HYSOL KL G450S epoxy molding compound delivers outstanding performance and ease of use. LOCTITE HYSOL KL G450S meets UL 94 V-0 Flammability at 3.175mm thickness. Product Benefits - Green product - Low stress - High reliability

LOCTITE HYSOL KL G730 epoxy molding compound delivers outstanding performance and ease of use. This material is designed to achieve JEDEC Level 1 requirements, at 260°C reflow temperature. Hysol® LOCTITE HYSOL KL G730 offers enhanced reliability peformance for T/LQFP packages. LOCTITE HYSOL KL G730 meets UL 94 V-0 Flammability at 3.175mm thickness. Product Benefits - High adhesion - Low stress - Green product - Low viscosity - Low wire sweep molding - Large operating window

LOCTITE HYSOL KL-G 100 epoxy molding compound contains no bromine, antimony or phosphorus flame retardant. This material is designed to achieve JEDEC Level 3 requirements, at 260°C reflow temperature. LOCTITE HYSOL KL-G 100 provides the lowest cost of ownership with superior moldability and reliability.

LOCTITE HYSOL KL-G 200 epoxy molding compound delivers outstanding performance and ease of use. LOCTITE HYSOL KL-G 200 provides the lowest cost of ownership with superior moldability and reliability.

LOCTITE HYSOL KL-G 200S epoxy molding compound contains no bromine, antimony or phosphorus flame retardant. This material is designed to achieve JEDEC Level 1 requirements, at 260°C reflow temperature. LOCTITE HYSOL KL-G 200S provides the lowest cost of ownership with superior moldability and reliability. LOCTITE HYSOL KL-G 200S meets UL 94 V-0 Flammability at 6.35mm thickness. Product Benefits - Green product - High moldability

LOCTITE HYSOL KL-G 500HT epoxy molding compound delivers outstanding performance and ease of use.

Hysol® LOCTITE HYSOL KL-G 900HC epoxy molding compound contains no bromine, antimony or phosphorus flame retardant. This material is designed to achieve JEDEC Level 2 requirements, at 260°C reflow temperature. LOCTITE HYSOL KL-G 900HC meets UL 94 V-0 Flammability at 3.175mm thickness. Product Benefits - Green product - Low wire sweep molding - Low warpage

LOCTITE® PE 3140 Epoxy Resin is a low viscosity, general purpose potting compound resin that is designed to be mixed with LOCTITE® PE 3160 epoxy hardener. This mixture forms a resilient, long work time, no blush potting compound with good surface finish and bond strength to most thermoplastics.

LOCTITE® PE 3140 Epoxy Resin is a low viscosity, resin that is designed to be mixed with LOCTITE® PE 3162 Hardener. This mixture forms a fast gelling, low viscosity, room temperature cure potting compound.

LOCTITE® PE 3140 Epoxy Resin is a low viscosity, resin that is designed to be mixed with LOCTITE® PE 3165 Hardener. This mixture forms a resilient, low exotherm, room temperature gel material that develops high Tg after exposure to elevated temperatures (200°F for 2-4 hours).

LOCTITE® PE 3141 Epoxy Resin is a resin formulated to offer improved long term performance at higher temperatures when mixed with LOCTITE® PE 3160 Epoxy Hardener. This mixture forms a resilient, long work time, no blush potting compound with good surface finish and bond strength to most thermoplastics.