A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate attach. In opto-packaging, it can be used as the main gasket seal of glass plates in LCDs, or for sealing filter windows onto opto-sensors.

A single component, B-stageable, optical grade epoxy for fiber optic assembly. It may be used for B-stage sealing of fiber cables into ferrules, or fiber optic feed-through into the opto-package. B-stage adhesive joining of glass or optics can also be realized.

EPO-TEK® N20E is a two component, electrically and thermally conductive, epoxy adhesive designed for semiconductor and electronics assembly. Its applications and field conditions include the optical, sensor, consumer, and industrial industries.

EPO-TEK® OD2002 is a two component, thermally and electrically insulating, optical epoxy. Designed as a high Tg yet still complilant alternative to EPO-TEK® 353ND.

A two component, high Tg, high temperature grade epoxy designed for semiconductor, underfill, hard-disk drive and hybrid micro-electronics packaging applications. The epoxy can also be used for adhesive and sealing applications in electronics, optical, and medical devices.

A two component epoxy designed for low stress applications in fiber optic packaging, opto-electronics and semiconductors. It is a lower modulus version of EPO-TEK® 353ND.

A two component, low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the electronics, medical, and optical industries. It is a black version of EPO-TEK® OE121.

A two component, optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23°C to 80°C, suggested for opto-device flip chip packaging. It can also be used for general potting and encapsulation.

EPO-TEK® OE138 is a two component epoxy with intermediate viscosity range between EPO-TEK®353ND and EPO-TEK® 353ND-T. It is designed for semiconductor glob top applications, as well as use in medical and fiber optic industries.

A two component, high Tg, optically clear epoxy for packaging and assembly of fiber optics cables and components. It is suggested for termination of fibers into ferrules, or fabrication of waveguide devices. It is a faster curing alternative to EPO-TEK® 353ND.

EPO-TEK® OE188 is a low CTE, designed for semiconductor and fiber optic applications.

EPO-TEK® OG116 is a single component, high index, high Tg, UV cure high viscosity adhesive. It was designed for optoelectronic applications including fiber optics packaging, sensor devices, SCI-OEM optics, and general electronic assembly.

EPO-TEK® OG116-31 is a single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, medical, and scientific/OEM industries.

EPO-TEK® OG133-8 is a single component, UV curable, thixotropic flexible epoxy adhesive/encapsulant designed for semiconductor and opto-electronic packaging. Glob top over IC and wire bonds, and low stress bonding of fiber optic components, are common applications. It is a replacement for EPO-TEK® OG133-5, and a non-flow version of EPO-TEK® OG133-7.

EPO-TEK® OG142 is a single component, UV curable epoxy, designed for adhesive, sealing, and encapsulating applications found in semiconductor, electro-optics, fiber optics, medical and scientific/OEM industries. It is a clear and colorless, high Tg epoxy.

EPO-TEK® OG142-112 is a single component, low viscosity epoxy for adhesive sealing and encapsulating fiber optic and opto-electronic packaging applications.

EPO-TEK® OG142-87 is a single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application. It is a replacement version of EPO-TEK® OG142-13 with better bonding strength and moisture resistance.

EPO-TEK® OG142-95 is a single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging applications. It is a replacement version of EPO-TEK® OG142-17 with better bonding strength and moisture resistance.

EPO-TEK® OG154-1 is a single component, UV curable epoxy adhesive for the semiconductor, opto-electronics, medical, and scientific OEM industry. It is a replacement for EPO-TEK® OG154.

EPO-TEK® OG159-2 is a single component, high viscosity, UV curable epoxy adhesive designed for sealing glass plates together in the LCD/OLED/display industry. It contains 1mil glass beads for bond line control. Common applications include semiconductor, electro-optics, fiber optic, and scientific/OEM. It can be applied by screen printing or dispensing techniques. It is capable of coating, adhering, sealing, and encapsulating devices.

A single component, UV/visible shifted light curable epoxy, designed for adhesive, sealing, coating and encapsulating applications found in semiconductor, electro-optics, fiber optics, medical, and scientific/OEM industries. It is a low viscosity, all-purpose adhesive.

EPO-TEK® OG198-54 is a single component, low viscosity, electrically and thermally insulating UV cure, medical grade epoxy.

EPO-TEK® OG198-55 is a high viscosity, single component, electrically and thermally insulating, translucent UV cure epoxy. It is the more thixotropic version of EPO-TEK® OG198-54.

A single component, low viscosity, UV curable adhesive designed for curing in seconds. It is an all-purpose, general adhesive for optical applications including fiber optic components, DVD, medical, and PCB level electro-optics. It can also be used for sealing and coating applications.

UV curable adhesive designed for glob top encapsulation

A UV fast curing, optically clear adhesive offering compliance and high strength.

Two component, general purpose, very fast setting epoxy adhesive.

Low halogen snap curable thixotropic longer pot life version of EPO-TEK® 353ND

EPO-TEK® OM125 is two component, high Tg, optical epoxy designed for bonding multi-mode fiber optic connectors.

A single component, high Tg, thermally conductive, semiconductor die-attach grade epoxy. It was designed for bonding chips and SMD's inside hybrid micro-electronic packages. Other applications include JEDEC and opto-electronic packaging.

A single component, thermally conductive and electrically insulating epoxy designed for semiconductor die attach and bonding of SMDs for hybrid microelectronic packaging. It can be used for heat sinking, solder dam or dielectric layers in circuit assembly applications.

EPO-TEK® T6067-3 is a single component thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging. It is a lower viscosity version of EPO-TEK® T6067.

EPO-TEK® T7109 is a two component, thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid, medical and optical industries.

EPO-TEK® T7109-17 is a flexible, thermally conductive, electrically insulating epoxy paste designed for low stress and heat dissipation applications within the semiconductor, hybrid, electronic and optical industries. It is a replacement for EPO-TEK® T7109-14.

A flexible, electrically insulating epoxy paste designed for low stress and heat dissipation applications. Alternative to EPO-TEK® T7109-17.

EPO-TEK® T7109-19 is a two component, flexible, thermally conductive, electrically insulating epoxy paste designed for low stress and heat dissipation applications. It is a lower outgassing version of EPO-TEK® T7109-17 with similar thermal management.

Flexible thermally conductive epoxy. A more flexible version of EPO-TEK® T7109-19.

EPO-TEK® T7110 is a two component, thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer, medical or optics.

Two component thermally conductive epoxy used for potting and encapsulating.

EPO-TEK® T7139 is a two component, electrically insulating, encapsulating epoxy designed for semiconductor glob top applications and package assembly.