ABLEFILM® 550™ adhesive film is designed for substrate attach and sealing microelectronic packages. This adhesive film gives off methanol, water, and ammonia during cure. Note: Using ABLEFILM® 550™ adhesive in hermetically sealed packages is not recommended.

ABLEFILM® 550K™ is designed for substrate attach and heat sink bonding.

ABLEFILM® 561 glass supported, modified epoxy adhesive film is designed for bonding materials with severely mismatched coefficients of thermal expansion. In many bonding applications, components bonded with ABLEFILM 561 adhesive film can be repaired. After heating the component to 150°C, de-bonding can be accomplished by sliding a thin blade, such as a razor blade, between the bonded surfaces. This adhesive film is also available in a low temperature cure version.

ABLEFILM® 561K is designed for substrate attach and heat sink bonding. This adhesive film is designed for bonding materials with severely mismatched coefficients of thermal expansion. All data and results will vary with different thicknesses.

Ablefilm® ECF550 silver filled, epoxy adhesive film is designed for microelectronic applications which require electrical conductivity. When used for substrate attach, ECF550 adhesive film acts as an electrical ground plane. In the assembly or sealing of microelectronic packages which require RF shielding, ECF550 adhesive film maintains electrical continuity between joints. Ablefilm ECF550 adhesive film provides strong adhesion to gold and other difficult-to-bond metals. After exposure to moisture, it retains its bond strength. This adhesive film is also available in a low temperature cure version.

Ablefilm® ECF550S silver filled epoxy adhesive film is designed for microelectronic applications which require electrical conductivity. This adhesive film is supported by a 3.5-mil silver screen carrier. ECF550S adhesive film provides thermal conductivity values of 1.4 to 3.8 W/m°K, depending upon bondline pressure and initial film thickness.

ABLEFILM® ECF550X silver filled, epoxy adhesive film is designed for microelectronic applications which require electrical conductivity. This material exhibits conductivity in the x, y, and z axes. When used for substrate attach, ECF550X acts as an electrical ground plane. It provides RF/EMI shielding.

ABLEFILM® ECF561E electrically conductive die attach adhesive is designed for bonding materials with severely mismatched coefficients of thermal expansion. When used for substrate attach, this adhesive film acts as an electrical ground plane.