20-3300 is a two part epoxy system formulated to meet the most critical electronic encapsulating requirements. This system has low shrinkage, high tensile and compressive strength. 20-3300 is ideal for high heat and thermal shock exposure. It has excellent adhesion to most substrates and forms a hermetic like seal to protect encapsulated parts. Great choice for high voltage applications. 20-3300 has a convenient 1:1 mix ratio with an extended pot life.

20-3301 is a two component epoxy resin system that provides a long working time and easy to use 1:2 mix ratio. Its low viscosity is ideal for many potting, sealing, encapsulating, and casting applications. 20-3301 is an electronic grade system designed to protect devices with outstanding thermal shock, vibration absorption, and thermal cycling properties. This epoxy system passes the Navy Hex Bar Test, MIL-I-16923C, consisting of 10 cycles from -55 to +155°C. 20-3301 is superior to most room temperature curing epoxies in terms of chemical resistance, wide service temperature range, electrical insulation, and overall physical properties. It is typically cured at 80°C for 1-2 hours; however a post cure of 150°C for 3 hours will enhance performance properties. Applications for 20-3301 include electronic potting and encapsulating, casting, coating, and electrical varnishes. This epoxy system is a good choice for high temperature applications that require a material that is not rigid and brittle. Features: - Toughness over a wide temperature range - Thermal shock resistance - Long working time - Chemical resistance - RoHS and REACH compliant - DOT Non-Hazardous - Unfilled with easy to use mix ratio

20-3302 is a two component, ultra clear epoxy system. It provides excellent optical transmission along with outstanding adhesion and electrical properties. This high purity grade polymer system is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy. This adhesive\potting compound, when UV aged in a QUV Weatherometer, outperforms other commercially available epoxy systems. 20-3302 is a low viscosity system designed for L.E.D. encapsulating, fiber optics, and any potting or adhesive application requiring optimum clarity. This epoxy system also provides a bubble free and glass smooth finish. 20-3302NCLV is a lower viscosity version of 20-3302. Both resins utilize the same curing agent. Features: - Low viscosity - Water clear - Outstanding electrical properties - Bubble free castings

20-3302 is a two component, ultra clear epoxy system. It provides excellent optical transmission along with outstanding adhesion and electrical properties. This high purity grade polymer system is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy. This adhesive\potting compound, when UV aged in a QUV Weatherometer, outperforms other commercially available epoxy systems. 20-3302 is a low viscosity system designed for L.E.D. encapsulating, fiber optics, and any potting or adhesive application requiring optimum clarity. This epoxy system also provides a bubble free and glass smooth finish. 20-3302NCLV is a lower viscosity version of 20-3302. Both resins utilize the same curing agent. Features: - Low viscosity - Water clear - Outstanding electrical properties - Bubble free castings

20-3305 is a two part epoxy system formulated to meet the most critical electronic encapsulating requirements. This system has low shrinkage with excellent electrical properties. The low viscosity makes it ideal for potting, sealing, encapsulating, and casting applications. 20-3305 is ideal for thermal shock exposure. It has excellent adhesion to most substrates and forms a hermetic like seal to protect encapsulated parts. Great choice for high voltage applications.

20-3401 is a two component clear epoxy resin system. It provides excellent optical transmission properties along with outstanding adhesion and electrical insulation. 20-3401 is a low viscosity system with an extended working time. It is designed for L.E.D. encapsulating, an underfill for flip chips, glob top encapsulation, fiber optics, and any potting or adhesive application requiring clarity. It has excellent adhesion to glass, quartz, most plastics, and metals. 20-3401 passes the Biocompatibility ISO 10993-5 Cytotoxicity Test. The independent lab test report is available upon request. 20-3401 is REACH and RoHS compliant. Features: - Low viscosity - Extended working time - Outstanding electrical properties - Optically clear - Packaged in FreezeBond® syringes - Passes ISO 10993-5 Cytotoxicity and USP <87>

40-3900 is a two component epoxy adhesive filled with silver. This electrically conductive epoxy resin formulation offers continuity of conductivity with an electrical resistivity value of less than 1x10^-4 ohm-cm. 40-3900 is also well known for its wide operating temperature range, -50 to + 170°C. 40-3900 is specifically designed for adhesive bonding in microelectronic and optoelectronic applications. Due to its excellent continuity, it has also been used extensively in applications such as micro-wave EMI and RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connectors, circuitry, and as a cold solder. 40-3900 is formulated with pure silver (no alloys) and is designed in a convenient 1:1 mix ratio. Both the resin and hardener have silver powder dispersed. Features: - Electrically conductive - Thermally conductive - Room temperature cure - Easy 1:1 mix ratio - Good bond strength

40-3901 is a two component epoxy adhesive filled with silver. This electrically conductive epoxy resin formulation offers an easy one to one mix ratio that cures at room temperature. 40-3901 is designed for adhesive bonding in microelectronic and optoelectronic applications. Due to its excellent continuity of conductivity, it has also been used extensively in applications such as micro-wave EMI and RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connectors, circuitry, and as a cold solder. 40-3901 is formulated with pure silver (no alloys). Both the resin and hardener have silver particles dispersed. Features: - Electrically conductive - Thermally conductive - Room temperature cure - Easy 1:1 mix ratio - Good bond strength

40-3907 is an electrically conductive epoxy system designed for applications requiring low temperature cures. 40-3907 will cure at room temperature in 18-24 hours or can be accelerated with mild heat. This is a solvent free epoxy system filled with silver. 40-3907 epoxy resin has a low hydrolyzable chloride content making it ideal for electronic applications. This epoxy also exhibits outstanding chemical resistance. Features: - Electrically conductive - Thermally conductive - Room temperature cure - Good bond strength - Excellent Chemical Resistance

40-3920 is a one component electrically conductive ink. 40-3920 is a silver filled polymer system which exhibits outstanding adhesion to a variety of substrates, such as kapton, mylar, glass, polyester, ceramic, etc. This thick film ink provides excellent conductivity for many electronic applications. It is screen printable and also sprayable. Application: - Membrane Switches - Flexible Circuits - Polymer Thick Film Circuits - EMI/RFI Sheilding Features: - Flexible - Low Electrical Resistance - Low viscosity - Excellent Adhesion

50-2151 FR is a high performance thermally conductive two component urethane system. This easy to use polyurethane is low in viscosity and ideal for potting or encapsulating delicate electronic components. 50-2151 FR exhibits very low shrinkage, stress, and exotherm throughout the cure cycle. This system is also well known for its outstanding thermal shock and excellent dielectric properties. 50-2151 FR is formulated to be flame retardant. It is a good choice when heat transfer and electrical insulation properties are required. Features: - Does not contain MOCA or TDI - Low viscosity - Very good thermal shock and vibration resistance - Low stress on components - Easy to handle - Low shrinkage

50-3100 is designed for the fastest and most continuous high heat transfer. 50-3100 measures several times faster heat dissipation than other commercially available types. The most important breakthrough is the handling of 50-3100. This system can be easily mixed and poured to form a dimensionally stable heat transfer package. Typical applications include encapsulation of power supplies, transformers, coils, insulators, protective covering for chips, temperature probes, etc…

50-3100 is designed for the fastest and most continuous high heat transfer. 50-3100 measures several times faster heat dissipation than other commercially available types. The most important breakthrough is the handling of 50-3100. This system can be easily mixed and poured to form a dimensionally stable heat transfer package. Typical applications include encapsulation of power supplies, transformers, coils, insulators, protective covering for chips, temperature probes, etc…

50-3100 is designed for the fastest and most continuous high heat transfer. 50-3100 measures several times faster heat dissipation than other commercially available types. The most important breakthrough is the handling of 50-3100. This system can be easily mixed and poured to form a dimensionally stable heat transfer package. Typical applications include encapsulation of power supplies, transformers, coils, insulators, protective covering for chips, temperature probes, etc…

50-3112 is a two component fast curing thermally conductive epoxy adhesive. This product was specifically formulated for use in the convenient TriggerBond® dual barrel cartridge system. 50-3112 has a simple 1:1 mix ratio and develops a 1,400 psi Lap Shear strength (aluminum to aluminum) in four hours at room temperature. After just twenty four hours the strength is over 2,200 psi. 50-3112 offers fast heat dissipation for a wide range of electronic applications. The black resin and white hardener provide an excellent visual indication of a complete mix. Features: - Fast room temperature cure - Thermally conductive - Packaged in TriggerBond® system - Forms strong bonds to a variety of substrates - Electrically insulating - Vibration and impact resistant

50-3116 thermally conductive flexible epoxy formulation is designed for applications that require low stress during cure and electrical insulation. 50-3116 is a low viscosity system that is most commonly used for potting and encapsulating power supplies, transformers, regulators, motors, capacitors, batteries, coils etc. This system is excellent in applications that require a compound to remain flexible for long term aging. This system has a low peak exotherm, making it ideal for large castings. The 50-3116 resin and catalyst is sold in convenient quart kits, gallon kits, 5 gallon pails, and 55 gallon drums. This system is also available in premixed and frozen syringes.

50-3122 is a one component (no mixing is necessary) epoxy adhesive with a unique combination of physical properties. This adhesive provides both high shear and high peel strengths. It is also able to maintain exceptionally strong bonds over a wide temperature range of -60 to +205°C. 50-3122 is formulated to offer superior resistance to impact, thermal shock, vibration and stress fatigue cracking. This product does not contain solvents and is therefore a 100% solids system. 50-3122 passes NASA’s outgassing requirements per ASTM E595-07. 50-3122 is both a thermally conductive and electrically insulating epoxy adhesive. It is suitable for electronic, electrical, aerospace, appliance, automotive and industrial applications. Features: - High Thermal Conductivity - Electrically Insulating - Good Chemical Resistance - Superior Impact & Thermal Shock Resistance - One Component, No Mixing Required

50-3141FR is a toughened, two-component, fast curing thermally conductive epoxy adhesive that meets UL94 V-0 flame retardant requirements. This product was specifically formulated for use in the convenient TriggerBond dual barrel cartridge system. 50-3141FR has a 2:1 mix ratio and develops a 2,000 psi Lap Shear strength (aluminum to aluminum) in four hours at room temperature. 50-3141FR provides a unique combination of high lap shear strength, high peel resistance and impact endurance. Once fully cured, the epoxy adhesive is also resistant to a wide range of chemicals and solvents. The adhesive also offers higher heat performance than most fast setting epoxies. 50-3141FR offers fast heat dissipation for a wide range of electronic applications. The black resin and off-white hardener provide an excellent visual indication of a complete mix. Features: - Fast room temperature cure - Low Odor - Thermally conductive - Flame retardant - Packaged in TriggerBond system - Forms strong bonds to a variety of substrates - Electrically insulating - Vibration and impact resistant

50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-0. 50-3150 FR Black Epoxy with Catalyst 12, Catalyst 190 and Catalyst 30 are listed with Underwriter's Laboratory for passing UL94 V-0. This system offers excellent heat transfer, low shrinkage, and outstanding insulation properties. 50-3150FR with Catalyst 30 has a UL (746B) Relative Temperature Index (RTI) rating of 130°C. 50-3150FR Black with Catalyst 190 passes NASA's outgassing requirements per ASTM E595-07. Typical applications for 50-3150 FR include encapsulating power supplies, transformers, coils, insulators, sensors, etc... This system is an excellent choice for applications requiring high thermal conductivity and flame retardancy.

50-3151 NC FR has been formulated to meet the stringent non-burning requirements of UL 94 V-0. This system offers excellent heat transfer, low shrinkage, and outstanding insulation properties. 50-3151 NC FR is low in viscosity and therefore offers outstanding flow around components. Typical applications for 50-3151 NC FR include encapsulating power supplies, transformers, coils, insulators, sensors, etc... This system is an excellent choice for applications requiring high thermal conductivity, flame retardancy, and low viscosity.

50-3152 FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL 94 V-0. 50-3152FR Epoxy is listed with Underwriter's Laboratories for passing UL 94 V-0. It also has a Comparative Tracking Index (CTI) of >600 Volts (PLC 0). 50-3152 FR is a two component epoxy potting and encapsulating system. This semi-rigid epoxy has excellent shock and vibration resistance along with good thermal conductivity. 50-3152 FR is designed for ease of use. It has a convenient 1:1 mix ratio and is low in viscosity. Features: - Thermally conductive - Easy 1:1 ratio - Shock and vibration resistant Benefits: - Protects electronics by quickly transferring heat - Simple to use in production - Will not damage electronic components

50-3170 is a high performance, thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure. 50-3170 can be used for bonding sensitive components or for potting of power supplies, coils, glass diodes, and other delicate assemblies. This new formulation can be used successfully for transformers, regulators, PCB's, etc... 50-3170 is an ideal resin system for encapsulation of electronic packages with low stress requirements. The resin has a rubber consistency and retains its properties and flexibility on long term aging. This allows pottings and castings to be probed for detection of electrical failure. 50-3170 is a repairable system. After defective components have been located, the probe path can be totally sealed by applying fresh resin with a hypodermic syringe. 50-3170 will bond to itself forming a totally sealed system.

50-3182 NC is a highly filled epoxy system with excellent physical, electrical, and thermal properties. 50-3182 NC offers very high thermal conductivity, excellent electrical insulation, and low thermal expansion. This unique combination of properties makes this system ideal for applications where electrical insulation and mechanical protection must be maintained while transferring heat. Applications: - 50-3182 NC is ideal for high voltage applications such as power supplies, transformers, high voltage insulators, bushings, etc...

50-3182 NC is a highly filled epoxy system with excellent physical, electrical, and thermal properties. 50-3182 NC offers very high thermal conductivity, excellent electrical insulation, and low thermal expansion. This unique combination of properties makes this system ideal for applications where electrical insulation and mechanical protection must be maintained while transferring heat. Applications: - 50-3182 NC is ideal for high voltage applications such as power supplies, transformers, high voltage insulators, bushings, etc...

50-3182 NC is a highly filled epoxy system with excellent physical, electrical, and thermal properties. 50-3182 NC offers very high thermal conductivity, excellent electrical insulation, and low thermal expansion. This unique combination of properties makes this system ideal for applications where electrical insulation and mechanical protection must be maintained while transferring heat. Applications: - 50-3182 NC is ideal for high voltage applications such as power supplies, transformers, high voltage insulators, bushings, etc...

50-3185 NC is a filled epoxy encapsulant possessing excellent physical, electrical, and thermal properties. 50-3185 NC is an excellent choice where low thermal expansion, outstanding electrical insulation and/or high thermal conductivity is required. Three catalysts are available to choose from. When cured with Catalyst 190 or Catalyst 30 this system meets NASA's outgassing requirements. Features: - Low Thermal Expansion - Excellent Electrical Insulator - High Thermal Conductivity - Protects & Conceals Circuitry Applications: - 50-3185 NC is ideal for high voltage applications such as power supplies, transformers, high voltage insulators, bushings, etc...

50-3185 NC is a filled epoxy encapsulant possessing excellent physical, electrical, and thermal properties. 50-3185 NC is an excellent choice where low thermal expansion, outstanding electrical insulation and/or high thermal conductivity is required. Three catalysts are available to choose from. When cured with Catalyst 190 or Catalyst 30 this system meets NASA's outgassing requirements. Features: - Low Thermal Expansion - Excellent Electrical Insulator - High Thermal Conductivity - Protects & Conceals Circuitry Applications: - 50-3185 NC is ideal for high voltage applications such as power supplies, transformers, high voltage insulators, bushings, etc...

50-3185 NC is a filled epoxy encapsulant possessing excellent physical, electrical, and thermal properties. 50-3185 NC is an excellent choice where low thermal expansion, outstanding electrical insulation and/or high thermal conductivity is required. Three catalysts are available to choose from. When cured with Catalyst 190 or Catalyst 30 this system meets NASA's outgassing requirements. Features: - Low Thermal Expansion - Excellent Electrical Insulator - High Thermal Conductivity - Protects & Conceals Circuitry Applications: - 50-3185 NC is ideal for high voltage applications such as power supplies, transformers, high voltage insulators, bushings, etc...

50-3186 NC is a two part thermally conductive epoxy adhesive. This thixotropic adhesive provides high temperature bonds to a variety of substrates. 50-3186 NC is a perfect choice for applications requiring high thermal conductivity, low thermal expansion, and high operating temperature performance.

50-3253FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL 94 V-0. This medium viscosity system offers high thermal conductivity, low shrinkage, low exotherm, and outstanding electrical insulation properties. The high thermal conductivity helps extend the life of assemblies by quickly dissipating heat away from critical components. 50-3253FR is designed for ease of use. It has a convenient 1:1 mix ratio. Typical applications for the 50-3253FR include potting and encapsulating power supplies, transformers, batteries, coils, insulators, sensors, etc. The 50-3253FR is an excellent choice for applications that require a flame retardant compound with high thermal conductivity. Features: - Thermally conductive - Easy 1:1 ratio - Shock and vibration resistant - Flame Retardant Benefits: - Protects electronics by quickly transferring heat - Ideal for use with meter mix dispense equipment - Will not damage electronic components - Meets UL94 V-0 non-burning requirements

UV Cure 60-7155 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. UV 60-7155 is water clear and is designed to be used as an adhesive, coating, or encapsulant. This system is moisture and chemical resistant. UV Cure 60-7155 is a good choice for potting and encapsulating applications due to its ability to deep section cure up to ¾ inch. Another unique and important feature is its ability to "dark cure." Once exposed to UV light the UV Cure 60-7155 will continue to cure in the absence of light. This is advantageous when potting or joining substrates with shadow areas. UV Cure 60-7155 may also be heat cured as a secondary cure operation. UV Cure 60-7155 is not affected by oxygen and will not have a sticky or greasy surface. The surface is rigid, smooth, and glossy when properly cured. UV Cure 7155 bonds to metal, plastic, aper and ceramic. UV Cure 60-7170 is a higher viscosity version of UV Cure 60-7155. Features: - One component - Excellent adhesion - Contains no solvents - Good electrical insulation - Low shrinkage - No out gassing - Will shadow cure - Good weathering resistance - Cure is not inhibited by oxygen - Low odor

UV Cure 60-7156 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. UV 60-7156 is water clear and is designed to be used as an adhesive, coating, or encapsulant. This system is moisture and chemical resistant. Its low durometer (flexibility) provides less stress on sensitive electronic components. UV Cure 60-7156 is a good choice for potting and encapsulating applications due to its ability to deep section cure up to ¾ inch. Another unique and important feature is its ability to "dark cure." Once exposed to UV light the UV Cure 60-7156 will continue to cure in the absence of light. This is advantageous when potting or joining substrates with shadow areas. UV Cure 60-7156 may also be heat cured as a secondary cure operation. UV Cure 60-7156 is not affected by oxygen and will not have a sticky or greasy surface. The surface is flexible, smooth, and glossy when properly cured. UV Cure 7156 bonds to metal, plastic, paper and ceramic. Features: - One component - Contains no solvents - Low shrinkage - Will shadow cure - Cure is not inhibited by oxygen - Excellent adhesion - Good electrical insulation - No out gassing - Good weathering resistance - Low odor

UV Cure 60-7158 is a UV Curable Epoxy Adhesive formulated to bond rigid substrates. This adhesive bonds extremely well to aluminum while also providing good water and chemical resistance. UV Cure 60-7158 is a semi-rigid adhesive and it is well suited for bonding rigid substrates. It is thixotropic and will not run once applied to the substrate. UV Cure 60-7158 does not contain any solvents, has little shrinkage and provides a smooth non-sticky surface. Features: - Excellent Adhesion - No Odor - Good Water & Chemical Resistance - Good Surface Cure

UV Cure 60-7170 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. UV 60-7170 is water clear and is designed to be used as an adhesive, coating, or encapsulant. This system is moisture and chemical resistant. UV Cure 60-7170 is a good choice for potting and encapsulating applications due to its ability to deep section cure up to ¾ inch. Another unique and important feature is its ability to "dark cure." Once exposed to UV light the UV Cure 60-7170 will continue to cure in the absence of light. This is advantageous when potting or joining substrates with shadow areas. UV Cure 60-7170 may also be heat cured as a secondary cure operation. UV Cure 60-7170 is not affected by oxygen and will not have a sticky or greasy surface. The surface is rigid, smooth, and glossy when properly cured. UV Cure 7170 bonds to metal, plastic, paper and ceramic. UV Cure 60-7155 is a lower viscosity version of UV Cure 60-7170. Features: - One component - Excellent adhesion - Contains no solvents - Good electrical insulation - Low shrinkage - No out gassing - Will shadow cure - Good weathering resistance - Cure is not inhibited by oxygen - Low odor

70-3812 NC is a two component, aluminum filled epoxy system. This system is used for making heat resistant tools, parts, or bonds that require the highest thermal conductivity and heat resistance. We have developed this extremely conductive epoxy by formulating it with a unique combination of fillers, particle sizes and dispersion techniques. 70-3812 NC has good heat dissipation making this a popular choice for a variety of heat sink applications. Common heat sink bonding applications include fin to base, folded-fin set to base, pin-fin set to base, and cold plate tube to extruded base. The 70-3812RNC is formulated with high performance materials and additives that give heat sink manufacturers improved adhesion and processing advantages. 70-3812 NC passes NASA's outgassing requirements per ASTM E-595-07. Features: - Excellent Thermal Conductivity - Superior Adhesion - Low viscosity allows quick self leveling

70-3814 is a two component fast curing aluminum filled thermally conductive epoxy adhesive. This product was specifically formulated for use in the convenient TriggerBond dual barrel cartridge system. 70-3814 has a simple 1:1 mix ratio and develops a Lap Shear Strength of over 1,000 psi in four hours at room temperature. After just twenty four hours the strength is 2,900 psi. 70-3814 offers fast heat dissipation for a wide range of assembly applications. The quick heat dissipation makes this a popular choice for many heat sink bonding applications. Features: - Fast room temperature cure - Thermally conductive - Packaged in TriggerBond system - Forms strong bonds to a variety of substrates - Aluminum filled - Vibration and impact resistant