Époxy (Époxy): INSUL-PLATE™
Produit | Disponibilité | Description du produit |
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INSUL-PLATE™ X-28057-2HT | Amérique du Nord |
SBNA INSUL-PLATE™ Hole-Fill material delivers true reliability and superior performance. This material, in powder form, is specifically suited for Hole-Fill use in glass epoxy, multi-layer and polyimide metal core circuit boards. The material is designed to meet or exceed the higher process and post-cure temperatures required for polyimide prepregs. SBNA Hole-Fill powder offers excellent adhesion to the metal core plates while maintaining the required mechanical and electrical properties. In addition, INSUL-PLATE material readily accepts plating with excellent adhesion. Vyncolit monitors the material on a lot-to-lot basis to assure a consistent product and to provide the high reliability required for metal core and multi-layer board applications.
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