Polysulfone (PSU) by SABIC
Produit | Disponibilité | Description du produit |
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LNP™ THERMOCOMP™ Compound JF002R | Afrique & Moyen-Orient |
LNP THERMOCOMP JF002R compound is based on Polyethersulfone (PES) resin containing 10% glass fiber/glass bead. Added features of this grade include: Mold Release.
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LNP™ THERMOCOMP™ Compound JF003E | Afrique & Moyen-Orient |
LNP THERMOCOMP JF003E compound is based on Polyethersulfone (PES) resin containing 15% glass fiber. Added features of this grade include: Easy Molding.
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LNP™ THERMOCOMP™ Compound JF004 - Americas | Amérique du Nord |
LNP THERMOCOMP JF004 compound is based on Polyethersulfone (PES) resin containing 20% glass fiber.
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LNP™ THERMOCOMP™ Compound JF004 - Asia | Asie Pacifique |
LNP THERMOCOMP JF004 compound is based on Polyethersulfone (PES) resin containing 20% glass fiber.
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LNP™ THERMOCOMP™ Compound JF004 - Europe | Europe |
LNP THERMOCOMP JF004 compound is based on Polyethersulfone (PES) resin containing 20% glass fiber.
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LNP™ THERMOCOMP™ Compound JF004E - Americas | Amérique du Nord |
LNP THERMOCOMP JF004E compound is based on Polyethersulfone (PES) resin containing 20% glass fiber. Added features of this grade include: Easy Molding.
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LNP™ THERMOCOMP™ Compound JF004E - Asia | Asie Pacifique |
LNP THERMOCOMP JF004E compound is based on Polyethersulfone (PES) resin containing 20% glass fiber. Added features of this grade include: Easy Molding.
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LNP™ THERMOCOMP™ Compound JF004E - Europe | Europe |
LNP THERMOCOMP JF004E compound is based on Polyethersulfone (PES) resin containing 20% glass fiber. Added features of this grade include: Easy Molding.
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LNP™ THERMOCOMP™ Compound JF004EXP | Afrique & Moyen-Orient |
LNP THERMOCOMP JF004EXP compound is based on Polyethersulfone (PES) resin containing 20% glass fiber. Added features of this grade include: Easy Molding.
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LNP™ THERMOCOMP™ Compound JF004L | Afrique & Moyen-Orient |
LNP THERMOCOMP JF004L compound is based on Polyethersulfone (PES) resin containing 20% glass fiber. Added features of this grade include: Low Extractables
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LNP™ THERMOCOMP™ Compound JF004RXP | Afrique & Moyen-Orient |
LNP THERMOCOMP JF004RXP compound is based on Polyethersulfone (PES) resin containing glass fiber. Added features of this grade include: Mold Release.
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LNP™ THERMOCOMP™ Compound JF004Z | Afrique & Moyen-Orient |
LNP THERMOCOMP JF004Z compound is based on Polyethersulfone (PES) resin containing 20% glass fiber. Added features of this grade include: High Viscosity, suitable for Extrusion.
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LNP™ THERMOCOMP™ Compound JF006 - Americas | Amérique du Nord |
LNP THERMOCOMP JF006 compound is based on Polyethersulfone (PES) resin containing 30% glass fiber.
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LNP™ THERMOCOMP™ Compound JF006 - Europe | Europe |
LNP THERMOCOMP JF006 compound is based on Polyethersulfone (PES) resin containing 30% glass fiber.
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LNP™ THERMOCOMP™ Compound JF006E - Americas | Amérique du Nord |
LNP THERMOCOMP JF006E compound is based on Polyethersulfone (PES) resin containing 30% glass fiber. Added features of this grade include: Easy Molding.
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LNP™ THERMOCOMP™ Compound JF006E - Europe | Europe |
LNP THERMOCOMP JF006E compound is based on Polyethersulfone (PES) resin containing 30% glass fiber. Added features of this grade include: Easy Molding.
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LNP™ THERMOCOMP™ Compound JF006EXZ | Afrique & Moyen-Orient |
LNP THERMOCOMP JF006EXZ compound is based on Polyethersulfone (PES) resin containing 30% glass fiber. Added features of this grade include: Easy Molding.
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LNP™ THERMOCOMP™ Compound JF006LXZ | Afrique & Moyen-Orient |
LNP THERMOCOMP JF006LXZ compound is based on Polyethersulfone (PES) resin containing 30% glass fiber. Added features of this grade include: Low Extractables.
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LNP™ THERMOCOMP™ Compound JF006LZZ | Afrique & Moyen-Orient |
LNP THERMOCOMP JF006LZZ compound is based on Polyethersulfone (PES) resin containing 30% glass fiber. Added features of this grade include: Extrusion grade, Low Extractables.
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LNP™ THERMOCOMP™ Compound JX97000 | Afrique & Moyen-Orient |
LNP THERMOCOMP JX97000 compound is based on Polyethersulfone (PES) resin containing 30% glass fiber. Added features of this grade include: Mold Release.
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