Kimura® K13X

ジェネリックファミリー： Elastomer, Specialty • 提供元： Precision Polymer Engineering Ltd.

A dark brown high performance polymer containing a unique self- reinforcing polymer structure, developed specifically for critical semiconductor applications. The high purity of the polymer combined with the absence of any fillers makes this polymer suitable for processes involving lower feature sizes. This material has a low coefficient of thermal expansion, low compression set and has an extremely low etch rate in aggressive plasma environments.

Key Attributes

Exceptionally pure - does not contain any fillers which may cause particulation problems.

Outstanding plasma resistance - ideal for Chlorine, Fluorine & Oxygen chemistries.

Exceptionally low plasma etch rate

Low thermal expansion

Retro-fits existing O-ring grooves (including FKM & FFKM grooves)

Low permeation

Low out-gassing

Low adhesion (reduced sticking)

Low friction, high strength and high modulus make K13X ideal for constant force dynamic applications.

Typical Applications

Dynamic seals

Static seals

Wafer-handling products

一般的な属性

Prospectorで無料のアカウントを作成し、Kimura® K13Xのデータシート詳細すべてにアクセスします。そこで、物理、機械、硬度仕様に関するすべての情報をご覧ください

材料ステータス

Commercial: Active

ドキュメント

Technical Datasheet (English)

ドキュメントのダウンロード

可用性

Asia Pacific, Europe, North America

用途

Electrical/Electronic Applications

その他の属性

Features, Appearance, Tensile Stress at 100%, Tensile Stress at 100%, Tensile Strength at Yield, Tensile Stress at Yield, Elongation at Break, Tensile Strain at Break, Compression Set, Compression Set, Durometer Hardness, Shore Hardness, IRHD Hardness, IRHD Hardness, Additional Properties, Additional Information

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