40-3901 is a two component epoxy adhesive filled with silver. This electrically conductive epoxy resin formulation offers an easy one to one mix ratio that cures at room temperature.

40-3901 is designed for adhesive bonding in microelectronic and optoelectronic applications. Due to its excellent continuity of conductivity, it has also been used extensively in applications such as micro-wave EMI and RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connectors, circuitry, and as a cold solder.

40-3901 is formulated with pure silver (no alloys). Both the resin and hardener have silver particles dispersed.

Features:
- Electrically conductive
- Thermally conductive
- Room temperature cure
- Easy 1:1 mix ratio
- Good bond strength