Chemraz ® E38 is specifically developed for high-density plasma systems and diffusion processes where seal reliability and minimal contamination are essential. It provides excellent chemical compatibility and withstands a variety of aggressive chemicals. Available in a range of geometries and cross-sections, Chemraz ® E38 offers the diversity required for dynamic or static dry processing applications. Recommended for slit valves, Chemraz ® E38 remains stable at service temperatures as high as 500°F (260°C) where high sealing loads are not used.

Chemraz ® SD517 is a white, high-purity, synthetic, fluorinated rubber with comparable chemical compatibility to polytetrafluoroethylene (PTFE). Chemraz ® SD517 is a choice material for high-performance seals and custom flexible shapes in pharma, biotech, and food applications with comprehensive compliance. In applications where EPDM, silicone, or FKM seals are unsuitable or require multiple replacement each year, Chemraz ® SD517 can dramatically improve process reliability and safety.

Chemraz ® SD625 is a black, synthetic, high-purity rubber with temperature and chemical compatibility similar to PTFE. Chemraz ® SD625 parts have high service temperatures (up to 500°F/260°C), near-universal chemical compatibility, and extensive compliance coverage. Chemraz ® SD625 is our best-performing seal material for pharma, biotech, cosmetic, and food processing applications. Chemraz ® SD625 seals have exceptional service lifetimes in steam-in-place (SIP) applications relative to FKM, silicone, and EPDM seals. Chemraz ® SD625 o-rings and gaskets typically maintain sealing after thousands of steam sterilization cycles, orders of magnitude longer than other materials.

Chemraz ® XCD, a perfluoroelastomer, is specifically designed to exceed the most rigorous demands of front-end semiconductor thermal processing equipment. Chemraz ® XCD withstands the extreme thermal challenges typically found in LPCVD (low pressure chemical vapor deposition), RTP (rapid thermal process), and epitaxial deposition systems. Because of its unique polymer and filler structure, Chemraz ® XCD provides the lowest compression set at high operating temperatures (> 572°F/300°C) of any perfluoroelastomer on the market, resulting in increased seal integrity and longer seal lifetimes. This means reduced downtime and higher wafer processing yields. With the lowest outgassing profile for perfluoroelastomer materials in high-temperature applications, Chemraz ® XCD provides a cleaner process environment. Because of its reduced surface stiction, Chemraz ® XCD can be used for semi-dynamic and static sealing applications. Chemraz ® XCD remains stable at operating temperatures up to 572°F (300°C) while maintaining exceptional compression set.

Protection against oxygen-infused plasma is key in many etch chamber environments. These harsh environments often break down non-resistant materials, causing harmful particulation and, ultimately, defective chips. Greene Tweed’s Chemraz ® XPE is highly resistant to O2 plasma and can be used in a wide range of applications, such as slit valve doors, reaction chamber lid seals, and gate valve seals. This advanced elastomeric material offers the semiconductor and solar industry an alternative to legacy products that quickly erode in the oxygen environment. With excellent resistance to both O2 and CF4 plasmas, this material affords an increased chip yield and maximized production. In addition, XPE seals provide customers with an increased MTBR (mean time between repair) to reduce downtime and maintenance costs.

Chemraz ® XRZ, a perfluoroelastomer, is specifically developed to exceed the most rigorous demands of aggressive in situ NF3 plasma cleaning. Chemraz ® XRZ withstands the application challenges typically found in HDPCVD (high-density plasma chemical vapor deposition), PECVD (plasma enhanced CVD), and newer PEALD (plasma-enhanced atomic layer deposition) process chambers. Because of its unique molecular composite structure, Chemraz ® XRZ provides the highest plasma resistance available to fluorine plasma processes, resulting in minimal contamination. This leads to increased seal integrity and longer seal lifetimes, reducing downtime and driving higher wafer processing yields. Chemraz ® XRZ can be used for both static and semi- dynamic dry wafer processing applications such as etch, deposition (CVD, HDPCVD, PEALD), and remote plasma cleans. Chemraz ® XRZ remains stable at operating temperatures up to 572°F (300°C) while maintaining exceptional compression set.

Chemraz ® XTR, a perfluoroelastomer, is specifically designed to withstand the highly corrosive environments that commonly occur from using ClF3 as a cleaning gas. Chemraz ® XTR addresses application challenges typically found in ALD (atomic layer deposition) of titanium nitride and other nitride-based film deposition. With its unique molecular composition combined with fillers, it provides the highest available chemical resistance to thermal cleaning processes using ClF3, resulting in minimal contamination, minimal weight loss, and longer seal lifetime. This means less downtime and higher wafer-processing yields. Chemraz ® XTR is recommended for both static and semi- dynamic applications in systems used for film deposition and etching, specifically for ALD of new barrier layers for advanced devices. These layers consist of materials that are difficult to etch; therefore, ClF3 is employed for cleaning. Chemraz ® XTR has high chemical resistance to corrosive fluorine-based chemistries at elevated temperatures. In addition, Chemraz ® XTR remains stable to service temperatures exceeding 572°F (300°C) while demonstrating exceptional compression set resistance. This combination of excellent chemical resistance and low compression set in the extremely elevated temperatures found in process chambers extends seal longevity.

This data represents typical values that have been calculated from all products classified as: Generic Perfluoroelastomer This information is provided for comparative purposes only.

A high hardness, extrusion resistant product with rapid gas decompression resistance. Targeted for applications in the Oil and Gas industry, and Chemical Process industry.

A low compression set, high temperature product for general purpose use in O-rings, seals and other Chemical Process industry applications. This product has excellent chemical resistance and good mechanical properties.

This product is targeted for use in the Life Sciences industry. Kalrez® 6221 offers excellent steam and overall chemical resistance, while reducing extractables from sealing materials to trace levels.

This product is targeted for use in the Life Sciences industry. Kalrez® 6230 offers excellent steam and overall chemical resistance, while reducing extractables from sealing materials to trace levels.

This product is targeted for use in the semiconductor wet process applications. It has excellent chemical resistance to wet process chemistry including acids bases and amine based strippers.

This product is targeted for use in the semiconductor metal CVD applications. It has excellent thermal stability, very low outgassing and excellent compression set properties.

This is a clear product for use in ash/strip applications. This product offers excellent resistance to plasma-cracking and ultra-low particle generation.

This is a general purpose semicon product for etching, ashing/stripping and deposition process applications. It has excellent mechanical strength and is suited for static and dynamic sealing applications.

This product is targeted for oxidation, diffusion, lamp anneal and RTP sealing applications. It has excellent thermal stability and significantly reduced outgassing properties at elevated temperatures.

This product is targeted for semicon UV-Ozone applications. It has outstanding UV-Ozone resistance, low sticking force and low particle generation.

This product is well suited for oxidation, diffusion, ALD, and LPCVD applications. It has excellent physical property and mechanical strength retention at elevated temperatures.

This product is targeted for PECVD, ALD, HDPCVD and Conductor Etch applications. It is designed for low erosion and ultra-low particle generation. It offers excellent thermal stability and good mechanical strength properties.

This product is designed for Dielectric (Oxide) Etch applications. It provides a balanced resistance to “physical” and “chemical” plasma erosion.

This product is targeted for deposition processes where ozone, ammonia and water vapor are used for processing. It offers excellent thermal stability and low outgassing.

This product is designed for high purity, high temperature vacuum applications where seals are exposed to Fluorine and Oxygen plasma radicals. It has a low erosion rate from plasma attack and ultra-low outgassing.

This product provides excellent performance in Oil and Gas applications. It combines best-in-class Rapid Gas Decompression and chemical resistance with good thermal stability.

This product is designed to offer outstanding performance in the widest range of chemicals and temperatures for the chemical process industry.

This product is targeted for use in chemical processes involving hot aggressive amines. It has excellent overall chemical resistance and mechanical properties.

This product has very low compression and high thermal stability. Designed for use in the Chemical Process, and Oil and Gas industries where excellent chemical resistance and high temperature performance is required.

This product is targeted for applications requiring high temperature performance and high hardness/high modulus properties.

This product is targeted for use in applications requiring minimal swell and improved property retention when exposed to aggressive chemicals and polymerizing monomers.

This product is targeted for use in chemical process applications requiring broad chemical resistance and excellent resistance to high temperature steam and water.

Kalrez® 7390 is a 90 durometer product designed for sealing the most demanding chemical and hot water/steam applications in the OIl and Gas, and Chemical Process industries. It has an upper service temperature of 300°C.

This product is targeted for use in PV wet and select dry manufacturing processes.

A visibly clear and highly reinforced perfluoroelastomer, combining ultra- high purity with excellent mechanical properties. Developed for use in advanced wet and dry semiconductor processes down to the 45nm node and beyond, this material has ultra-low out-gassing properties, high temperature stability and excellent plasma resistance to provide effective sealing in extreme conditions. Perlast® G100XT combines a fully fluorinated polymer backbone with a highly fluorinated cross-linking system to provide a material with exceptional resistance to high temperature and aggressive semiconductor processes. The fully organic structure of the material helps to eliminate particles and reduce cost of ownership. The superior chemical performance of the material is enhanced by exceptionally low compression set, high elongation and ultimate tensile strength. Perlast® G100XT has a low modulus, giving it a very high sealing efficiency. The material is highly resistant to stress induced chemical attack in constant compression or constant strain environments, leading to longer service life and reliable sealing performance. Key Attributes - Exceptionally pure - does not contain any inorganic fillers which may cause particulation problems. - High temperature stability - Exceptionally low compression set - Excellent mechanical properties - Ultra low out-gassing - High sealing efficiency - Reduced Cost of Ownership (CoO) Typical Applications - Static Seals - Wafer Handling Products

A translucent beige compound with semi-crystalline perfluoropolymer nano-filler, specially developed to meet the demands of the semiconductor and bio-analytical industries. Compatible with fluorine based chemistries and universally suitable for both wet and dry semiconductor processes including Lithography, Plasma, PVD, CVD, Etch, Stripping and Cleaning. Perlast® G67P combines a fully fluorinated polymer backbone, a fully fluorinated nano-filler system (no inorganic fillers) and a highly fluorinated cross-linking process, which results in a perfluoroelastomer with unrivalled purity and chemical resistance. Perlast® G67P has a significantly lower compressive modulus than traditional perfluoroelastomers, making it highly compliant. So for a given compression, it exhibits a low reaction force, this results in lower stress on the seal, which leads to longer life expectancy. Key Attributes - Exceptionally pure - does not contain any inorganic fillers which may cause particulation problems. - Excellent chemical and temperature resistance. - Excellent mechanical properties. - Extremely low out-gassing properties making it ideal for vacuum sealing applications. - High sealing efficiency. - High material compliance reduces surface permeation. - Reduced first wafer effect. - Lower cost of ownership. Typical Applications - Dynamic seals - Static seals - Wafer-handling products

Perlast® G70A uses a unique molecular cross-linking technology to offer the broadest range of chemical resistance of any FFKM with the ability to operate up to a maximum temperature of 260°C (500°F). An extremely versatile material, Perlast® G70A is suitable for 90% of sealing applications encountered in the chemical processing and refining industries, providing excellent resistance to highly aggressive acids, amines, chlorine and solvent-based chemistries. Perlast® G70A is available as fully moulded O-rings (any size up to 2m/6.5ft internal diameter), custom shapes and profiles. Key Attributes - Ultimate chemical resistance to a wide range of chemicals - Exceptional acid and amine resistance - Excellent steam resistance - Superior mechanical properties - High sealing efficiency Typical Applications - Pumps - Valves - Mechanical seals - Compressors (high H2S concentration environments) - Pressure vessels - Diesel engines (pre-chambers and exhaust systems) - Couplings & Fittings - Custom shapes and profiles

Description Perlast® G70H provides optimal performance in high-temperature, chemically and mechanically demanding environments. This highly reinforced material offers extended seal life, offering low plasma etch rates in flat panel and thin-film solar CVD processes and the high mechanical strength needed to cope with the high forces repeatedly applied in these large scale applications. Perlast® G70H is available as fully moulded O-rings (any size up to 2m/6.5ft internal diameter) and fully moulded formed slit valve door seals up to 3m in length for generation 10 and above. Key Attributes - Excellent plasma resistance - High temperature performance - High mechanical strength - High abrasion resistance - Extremely low out-gassing properties Typical Applications - Slit valve door seals - ISO valve seals - Load lock seals - NW / KF / ISO O-rings

A translucent beige compound with semi-crystalline perfluoropolymer nano-filler, specially developed to meet the demands of the semiconductor and bio-analytical industries. Compatible with fluorine based chemistries and universally suitable for both wet and dry semiconductor processes including Lithography, Plasma, PVD, CVD, Etch, Stripping and Cleaning. Perlast® G74P combines a fully fluorinated polymer backbone, a fully fluorinated nano-filler system (no inorganic fillers) and a highly fluorinated cross-linking process, which results in a perfluoroelastomer with unrivalled purity, chemical resistance and mechanical properties. Perlast® G74P exhibits extremely low out-gassing properties, making it ideal for use in vacuum applications. Key Attributes - Exceptionally pure - does not contain any inorganic fillers which may cause particulation problems. - Excellent chemical and temperature resistance. - Excellent mechanical properties. - Extremely low out-gassing properties making it ideal for vacuum sealing applications. - High material compliance reduces surface permeation. - Reduced first wafer effect. - Lower cost of ownership. Typical Applications - Dynamic seals - Static seals - Wafer-handling products

Perlast® G74S has been specifically developed to cope with a wide range of process media, potent active pharmaceutical ingredients (API's) and aggressive cleaning agents, being especially suited to withstand steam-in-place (SIP) and clean-in-place (CIP) procedures within pipe work and vessels. G74S is also suitable for other critical applications such as Water-For-Injection (WFI) systems. Perlast® G74S can be used for all types of applications requiring FDA and USP Class VI compliance. It is suitable for use in all product contact applications including dry, aqueous and fatty media. Perlast® G74S is suitable for both dynamic and static applications and can be moulded into O-rings and custom shapes. Key Attributes - Excellent chemical resistance to a wide range of chemicals - Superior mechanical properties - High tensile strength makes G74S ideal for dynamic applications - Excellent steam resistance (ASME BPE 2000) - FDA compliant - extraction tested to CFR 21 § 177.2600(e,f) - USP Class VI <88> and USP <87> compliant - 3-A Standard 18-03 Class 1 compliant - Free from Animal Derived Ingredients (ADI) Typical Applications - Dynamic seals - Static seals